Abstract
The elastic moduli of amorphous and crystalline atomic layer-deposited Hf1-xZrxO2 (HZO, x = 0, 0.31, 0.46, 0.79, 1) films prepared with TaN electrodes on silicon substrates were investigated using picosecond acoustic measurements. The moduli of the amorphous films were observed to increase between 211 ± 6 GPa for pure HfO2 and 302 ± 9 GPa for pure ZrO2. In the crystalline films, it was found that the moduli increased upon increasing the zirconium composition from 248 ± 6 GPa for monoclinic HfO2 to 267 ± 9 GPa for tetragonal ZrO2. Positive deviations from this increase were observed for the Hf0.69Zr0.31O2 and Hf0.54Zr0.46O2 compositions, which were measured to have moduli of 264 ± 8 GPa and 274 ± 8 GPa, respectively. These two compositions contained the largest fractions of the ferroelectric orthorhombic phase, as assessed from polarization and diffraction data. The biaxial stress states of the crystalline films were characterized through sin2(ψ) x-ray diffraction analysis. The in-plane stresses were all found to be tensile and observed to increase with the increasing zirconium composition, between 2.54 ± 0.6 GPa for pure HfO2 and 5.22 ± 0.5 GPa for pure ZrO2. The stresses are consistent with large thermal expansion mismatches between the HZO films and silicon substrates. These results demonstrate a device-scale means to quantify biaxial stress for investigation on its effect on the ferroelectric properties of hafnia-based materials.
Original language | English |
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Article number | 102901 |
Journal | Applied Physics Letters |
Volume | 118 |
Issue number | 10 |
DOIs | |
State | Published - Mar 8 2021 |
Funding
This work was supported, in part, by the Laboratory Directed Research and Development program at Sandia National Laboratories. Sandia National Laboratories is a multimission laboratory managed and operated by the National Technology and Engineering Solutions of Sandia, LLC, a wholly owned subsidiary of Honeywell International, Inc., for the U.S. Department of Energy’s National Nuclear Security Administration under Contract No. DE-NA0003525. This paper describes objective technical results and analysis. Any subjective views or opinions that might be expressed in this paper do not necessarily represent the views of the U.S. Department of Energy or the United States Government. This work was also supported, in part, by the Semiconductor Research Corporation’s (SRC) Global Research Collaboration Program. This research utilized a PHI VersaProbe III XPS system, which was supported by National Science Foundation Award No. 162601. S.T.J. acknowledges support from the National Science Foundation Graduate Research Fellowship Program under Award No. DGE-1842490. D.H.O. is grateful for funding from the National Defense Science and Engineering Graduate (NDSEG) Fellowship. D.H.O. and P.E.H. appreciate funding from the National Science Foundation, Grant No. DMR EPM 2006231. This manuscript was coauthored by UT-Battelle, LLC, under Contract No. DE-AC05-00OR22725 with the U.S. Department of Energy. The United States Government retains and the publisher, by accepting this article for publication, acknowledges that the United States Government retains a non-exclusive, paid-up, irrevocable, world-wide license to publish or reproduce the published form of this manuscript, or allow others to do so, for United States Government purposes.