Abstract
The influence of transverse shear strain in the lamination theory modeling of Printed Wiring Board (PWB) deflection due to support conditions was examined. The in-plane mechanical properties of the core materials of a commercial PWB were measured as a function of temperature. Classical laminated plate theory and first-order shear deformation theory solutions for the out-of-plane deflection of a bare board configuration with two opposite edges simply supported and the remaining edges free were obtained. The weight of the board was approximated as a distributed transverse load. The effect of material property decrease with temperature and FR-4 layer thickness were examined to compare first-order shear and plane strain assumptions for the predicted warpage.
| Original language | English |
|---|---|
| Title of host publication | Manufacturing Science and Engineering |
| Publisher | American Society of Mechanical Engineers (ASME) |
| Pages | 789-794 |
| Number of pages | 6 |
| ISBN (Electronic) | 9780791816066 |
| DOIs | |
| State | Published - 1998 |
| Externally published | Yes |
| Event | ASME 1998 International Mechanical Engineering Congress and Exposition, IMECE 1998 - Anaheim, United States Duration: Nov 15 1998 → Nov 20 1998 |
Publication series
| Name | ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) |
|---|---|
| Volume | 1998-R |
Conference
| Conference | ASME 1998 International Mechanical Engineering Congress and Exposition, IMECE 1998 |
|---|---|
| Country/Territory | United States |
| City | Anaheim |
| Period | 11/15/98 → 11/20/98 |
Funding
The authors would like to acknowledge the support of the Georgia Tech Manufacturing Research Center and the following organizations: Motorola, AT&T, Ford and Army Missile Command (MICOM). In particular the authors would like to acknowledge the support of Dr. Karl Wyatt of the Corporate Software Research & Development Center, Motorola, Schaumburg, IL.