Abstract
Residual stresses in four types of diamond films deposited by hot filament chemical vapor deposition on molybdenum substrate, three types on tungsten carbide or silicon nitride substrate are measured. Residual stresses are determined by X-ray method and Raman spectroscopy. The results from both these techniques are compared and conclusions are made on the mechanisms of adhesion of diamond films to the different substrates.
| Original language | English |
|---|---|
| Pages (from-to) | 391-396 |
| Number of pages | 6 |
| Journal | Materials Research Society Symposium - Proceedings |
| Volume | 505 |
| State | Published - 1998 |
| Externally published | Yes |
| Event | Proceedings of the 1997 MRS Fall Meeting - Boston, MA, USA Duration: Nov 30 1997 → Dec 4 1997 |