Cleaner Chips: Decarbonization in Semiconductor Manufacturing

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5 Scopus citations

Abstract

The growth of the information and communication technology sector has vastly accelerated in recent decades because of advancements in digitalization and Artificial Intelligence (AI). Scope 1, 2, and 3 greenhouse gas emissions data of the top six semiconductor manufacturing companies (Samsung Electronics, Taiwan Semiconductor Manufacturing Corporation, Micron, SK Hynix, Kioxia, and Intel) were gathered from the publicly accessible Carbon Disclosure Project’s (CDP) website for 2020. Scope 3 emissions had the largest share in total annual emissions with an average share of 52%, followed by Scope 2 (32%) and Scope 1 (16%). Because of the absence of a standardized methodology for Scope 3 emissions estimation, each company used different methodologies that resulted in differences in emissions values. An analysis of the CDP reporting data did not reveal information on strategies implemented by companies to reduce Scope 3 emissions. The use of renewable energy certificates had the largest effect on decarbonization centered on reducing Scope 2 emissions, followed by the deployment of perfluorocarbon reduction technologies to help reduce Scope 1 fugitive emissions. Technology-specific marginal abatement costs of CO2 were also estimated and varied between −416 and 12,215 USD/t CO2 eq., which primarily varied depending on the technology deployed.

Original languageEnglish
Article number218
JournalSustainability (Switzerland)
Volume16
Issue number1
DOIs
StatePublished - Jan 2024

Funding

This manuscript has been authored by UT-Battelle, LLC, under contract DE-AC05-00OR22725 with the US Department of Energy (DOE). The US government retains and the publisher, by accepting the article for publication, acknowledges that the US government retains a nonexclusive, paid-up, irrevocable, worldwide license to publish or reproduce the published form of this manuscript, or allow others to do so, for US government purposes. DOE will provide public access to these results of federally sponsored research in accordance with the DOE Public Access Plan https://www.energy.gov/doe-public-access-plan (accessed on 10 December 2023). This work was financially supported by the US Department of Industrial efficiency and decarbonization office, Washington, DC, USA under contract DE-AC05–00OR22725 with the US Department of Energy (DOE).

FundersFunder number
US Department of Industrial efficiency and decarbonization officeDE-AC05-00OR22725
U.S. Department of Energy

    Keywords

    • decarbonization levers of semiconductor manufacturing
    • information and communication technology
    • life cycle analysis
    • marginal abatement cost curves
    • semiconductor manufacturing
    • sustainability assessments

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