TY - JOUR
T1 - Chemical solution deposition of PLZT films on base metal foils
AU - Kim, D. J.
AU - Kaufman, D. Y.
AU - Streiffer, S. K.
AU - Lee, T. H.
AU - Erck, R.
AU - Auciello, O.
PY - 2003
Y1 - 2003
N2 - In an effort to develop cost effective, volumetrically efficient, high charge density and high energy density capacitors, Pb(Zr,Ti)O3 and La-doped Pb(Zr,Ti)O3 films were deposited by chemical solution deposition on nickel and alloy foils. PZT films deposited on bare foils exhibited lower permittivity and more electric field hysteresis compared to films deposited on platinized silicon substrates, due to the formation of low capacitance interfacial layers and/or diffusion of foil elements into the PZT. However, an ultimate dielectric breakdown strength of approximately 1.35 MV/cm was obtained for a film thickness of 1.8 μm, corresponding to a withstand voltage of 245 V. A reduced temperature dependence of capacitance was observed with decreasing film thickness. In order to improve the dielectric response, barrier layers of LaNiO3, Ru, or Ir were deposited on top of the metal foils used as substrates. The barrier improved relative permittivity and reduced hysteresis in relative permittivity as a function of dc bias.
AB - In an effort to develop cost effective, volumetrically efficient, high charge density and high energy density capacitors, Pb(Zr,Ti)O3 and La-doped Pb(Zr,Ti)O3 films were deposited by chemical solution deposition on nickel and alloy foils. PZT films deposited on bare foils exhibited lower permittivity and more electric field hysteresis compared to films deposited on platinized silicon substrates, due to the formation of low capacitance interfacial layers and/or diffusion of foil elements into the PZT. However, an ultimate dielectric breakdown strength of approximately 1.35 MV/cm was obtained for a film thickness of 1.8 μm, corresponding to a withstand voltage of 245 V. A reduced temperature dependence of capacitance was observed with decreasing film thickness. In order to improve the dielectric response, barrier layers of LaNiO3, Ru, or Ir were deposited on top of the metal foils used as substrates. The barrier improved relative permittivity and reduced hysteresis in relative permittivity as a function of dc bias.
UR - http://www.scopus.com/inward/record.url?scp=0038713606&partnerID=8YFLogxK
M3 - Conference article
AN - SCOPUS:0038713606
SN - 0272-9172
VL - 748
SP - 457
EP - 462
JO - Materials Research Society Symposium - Proceedings
JF - Materials Research Society Symposium - Proceedings
T2 - Ferroelectric Thin Films XI
Y2 - 2 December 2002 through 5 December 2002
ER -