Chasing Schottky-Mott: Metal-first non-alloyed contacts to β-Ga2O3 for interface quality and minimal surface modification

  • Kathleen T. Smith
  • , Cameron A. Gorsak
  • , Joshua T. Buontempo
  • , Bennett J. Cromer
  • , Takumi Ikenoue
  • , Hemant Gulupalli
  • , Michael O. Thompson
  • , Debdeep Jena
  • , Hari P. Nair
  • , Huili Grace Xing

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

Metal-first non-alloyed ohmic and Schottky contacts are fabricated on β -Ga 2 O 3 with a range of metal work functions ( ϕ M ). The resulting ohmic contacts are of high quality with a contact resistance ( R c ) as low as 0.069 ± 0.003 Ω mm. Measurements of the barrier heights ( ϕ B ) indicate that metal-first processing, which preserves the as-grown/bare-substrate surface, also partially un-pins the Fermi-level in (010) and ( 2 ¯ 01) oriented Ga 2 O 3 . Depth-resolved XPS (x-ray photoelectron spectroscopy) measurements of the oxidation state throughout the contact metal at the contact- Ga 2 O 3 interface indicate that most non-alloyed contact metals are at least partially oxidized by room temperature redox reactions with the underlying Ga 2 O 3 , with metals with a lower ϕ M also demonstrating the greatest level of oxidation. As oxidation has been previously observed to enhance a metal’s work function, this may imply that to-date observations of indices of surface behavior << 1 on β -Ga 2 O 3 , which have been attributed to severe Fermi-level pinning, may need to be corrected to account for this partial oxidation in addition to other surface modifications during device processing demonstrated in this work.

Original languageEnglish
Article number215302
JournalJournal of Applied Physics
Volume136
Issue number21
DOIs
StatePublished - Dec 7 2024
Externally publishedYes

Funding

This work was in part supported by ACCESS, an AFOSR Center of Excellence (No. FA9550-18-1-0529). C.A.G. acknowledges support from the National Defense Science and Engineering (NDSEG) Fellowship. This work was supported in part by SUPREME, one of seven centers in JUMP 2.0, a Semiconductor Research Corporation (SRC) program sponsored by DARPA. The device fabrication was performed in part at the Cornell Nanoscale Facility, a NNCI member supported by NSF grant (No. NNCI-2025233). This work used facilities and instrumentation supported by the NSF through the Cornell University Materials Research Science and Engineering Center (No. DMR-1719875).

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