TY - GEN
T1 - Characterization of physical properties and morphology of pani-based conductive composites
AU - Kumar, V.
AU - Yokozeki, T.
AU - Goto, T.
AU - Takahashi, T.
PY - 2014
Y1 - 2014
N2 - Polyaniline (PANI) is one of the most studied intrinsic electrically conductive polymer in recent years. However, the research on doping phenomenon and the mechanical properties of the PANI-based composite has been limited. In the present work, PANI-based conductive composites have been prepared using Dodecylbenzenesulphonic acid (DBSA) as a dopant and Divinylbenzene (DVB) as a cross-linking polymer to enhance the rigidity. In this mixture, DBSA act as the dopant of PANI as well as the curing agent of DVB, this means that doping and curing of the composite occur simultaneously. PANI-DBSA blend has been prepared by two different methods viz. using centrifugal mixer and using 3-roller mill. Two different set of composite samples have been prepared using these two blends. The ratio of PANI and DBSA has been kept constant in weight ratio 30:70. Furthermore, DVB content has been varied to prepare the different samples. It has been found that with the increase in DVB content, a good dispersion of PANI-DBSA/DVB solution is achieved. Significant improvement in the electrical conductivity of the samples is observed with the increase in PANI content. Mechanical flexural test has been performed on the prepared samples using 3-point bending configuration. It has been found that the flexural modulus and brittleness of the prepared samples increase with the increase in the content of DVB in the composite. Morphology of the composite surfaces has been also studied and it has been found that low concentration of DVB results into a poor dispersion and hence agglomeration of PANI-DBSA in composite can be seen clearly in the images. The results of electrical conductivity, mechanical properties and morphology of the composite samples made up of centrifugally mixed PANI-DBSA blend and roll-milled PANI-DBSA blend have been compared.
AB - Polyaniline (PANI) is one of the most studied intrinsic electrically conductive polymer in recent years. However, the research on doping phenomenon and the mechanical properties of the PANI-based composite has been limited. In the present work, PANI-based conductive composites have been prepared using Dodecylbenzenesulphonic acid (DBSA) as a dopant and Divinylbenzene (DVB) as a cross-linking polymer to enhance the rigidity. In this mixture, DBSA act as the dopant of PANI as well as the curing agent of DVB, this means that doping and curing of the composite occur simultaneously. PANI-DBSA blend has been prepared by two different methods viz. using centrifugal mixer and using 3-roller mill. Two different set of composite samples have been prepared using these two blends. The ratio of PANI and DBSA has been kept constant in weight ratio 30:70. Furthermore, DVB content has been varied to prepare the different samples. It has been found that with the increase in DVB content, a good dispersion of PANI-DBSA/DVB solution is achieved. Significant improvement in the electrical conductivity of the samples is observed with the increase in PANI content. Mechanical flexural test has been performed on the prepared samples using 3-point bending configuration. It has been found that the flexural modulus and brittleness of the prepared samples increase with the increase in the content of DVB in the composite. Morphology of the composite surfaces has been also studied and it has been found that low concentration of DVB results into a poor dispersion and hence agglomeration of PANI-DBSA in composite can be seen clearly in the images. The results of electrical conductivity, mechanical properties and morphology of the composite samples made up of centrifugally mixed PANI-DBSA blend and roll-milled PANI-DBSA blend have been compared.
UR - http://www.scopus.com/inward/record.url?scp=84961302477&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84961302477
T3 - Proceedings of the American Society for Composites - 29th Technical Conference, ASC 2014; 16th US-Japan Conference on Composite Materials; ASTM-D30 Meeting
BT - Proceedings of the American Society for Composites - 29th Technical Conference, ASC 2014; 16th US-Japan Conference on Composite Materials; ASTM-D30 Meeting
PB - DEStech Publications
T2 - 29th Annual Technical Conference of the American Society for Composites, ASC 2014; 16th US-Japan Conference on Composite Materials; ASTM-D30 Meeting
Y2 - 8 September 2014 through 10 September 2014
ER -