Abstract
Ultrasonic additive manufacturing (UAM) is a solid-state processing technique that uses ultrasonic vibrations to bond metal tapes into near net-shaped components. The benefits of UAM include the production of complex geometries and the incorporation of smart materials to produce functional composites and join dissimilar metals. The majority of the current research focuses on processing parameter optimization to eliminate macroscopic void formation at the interface. The present study utilizes ion-channeling contrast imaging from a focused ion beam, electron backscattered diffraction and transmission electron microscopy to examine microstructural changes induced during the UAM process. The results indicate that there is a bonding mechanism due to localized plastic deformation of asperities that undergo recrystallization and grain growth across the interface. Evidence for localized solidification microstructures, generated due to frictional sliding between the sonotrode horn and the tape material, is also presented.
| Original language | English |
|---|---|
| Pages (from-to) | 4305-4315 |
| Number of pages | 11 |
| Journal | Acta Materialia |
| Volume | 58 |
| Issue number | 13 |
| DOIs | |
| State | Published - Aug 2010 |
Funding
We thank the Edison Welding Institute and the contribution of the State of Ohio, Department of Development and Thomas Edison Program, which provided funding in support of the Edison Technology and Industry Center Services. We also thank Dr. Karl Graff and Mr. Matt Short for valuable help in introducing the UAM process to us and also for fruitful discussions. We also acknowledge the support and encouragement of Mr. Chris Conrardy from EWI in the above research.
| Funders | Funder number |
|---|---|
| Department of Development | |
| Edison Technology and Industry Center Services | |
| Edison Welding Institute | |
| Thomas Edison Program |
Keywords
- Aluminum alloy
- Plastic deformation
- Scanning electron microscopy
- Solid-state joining
- Ultrasonic additive manufacturing
