TY - GEN
T1 - Characterization and comparison of planar and trench Silicon Carbide (SiC) power MOSFETs
AU - Wang, Zhiqiang
AU - Chinthavali, Madhu
AU - Campbell, Steven
N1 - Publisher Copyright:
© The Electrochemical Society.
PY - 2016
Y1 - 2016
N2 - This paper presents a comprehensive evaluation and experimental comparison of silicon carbide power MOSFETs through double pulse test. First, a universal hardware platform is designed and developed to test power semiconductor devices with various device packages and measuring requirements. Using the developed platform, the static characteristics and switching performance of the two types of SiC MOSFETs (one planar and one trench type) are evaluated under different case temperatures from 25°C to 175°C. Based on the evaluation data, a comparison of both SiC MOSFETs is conducted in terms of their on-state resistance, switching loss, and temperature dependent behavior. It is found that the latest trench SiC MOSFETs present similar switching loss while much lower conduction loss compared to existing commercial planar SiC MOSFETs. Moreover, the trench devices show a nearly temperature independent switching loss, which is beneficial to suppress the potential thermal runaway issue under high temperature continuous operation.
AB - This paper presents a comprehensive evaluation and experimental comparison of silicon carbide power MOSFETs through double pulse test. First, a universal hardware platform is designed and developed to test power semiconductor devices with various device packages and measuring requirements. Using the developed platform, the static characteristics and switching performance of the two types of SiC MOSFETs (one planar and one trench type) are evaluated under different case temperatures from 25°C to 175°C. Based on the evaluation data, a comparison of both SiC MOSFETs is conducted in terms of their on-state resistance, switching loss, and temperature dependent behavior. It is found that the latest trench SiC MOSFETs present similar switching loss while much lower conduction loss compared to existing commercial planar SiC MOSFETs. Moreover, the trench devices show a nearly temperature independent switching loss, which is beneficial to suppress the potential thermal runaway issue under high temperature continuous operation.
UR - http://www.scopus.com/inward/record.url?scp=84991467083&partnerID=8YFLogxK
U2 - 10.1149/07512.0145ecst
DO - 10.1149/07512.0145ecst
M3 - Conference contribution
AN - SCOPUS:84991467083
T3 - ECS Transactions
SP - 145
EP - 152
BT - Gallium Nitride and Silicon Carbide Power Technologies 6
A2 - Dudley, M.
A2 - Bakowski, M.
A2 - Ohtani, N.
A2 - Shenai, K.
A2 - Raghothamachar, B.
PB - Electrochemical Society Inc.
T2 - Symposium on Gallium Nitride and Silicon Carbide Power Technologies 6 - PRiME 2016/230th ECS Meeting
Y2 - 2 October 2016 through 7 October 2016
ER -