Abstract
Due to growth temperature differences during deposition of GaN heterostructures utilizing InAlN barriers, an inadvertent parasitic GaN layer can form in the InAlN barrier layer. In structures utilizing AlN spacer layers, this parasitic layer acts as a second conduction channel with a carrier density dependent upon polarization charges and lattice strain as well as the surface potential. The effect of an additional GaN spacer layer in InAlN/AlN/GaN structures is assessed using simulations, electron-microscopy observations, magnetoconductivity measurements with gated Hall bar samples, and with quantitative mobility spectrum analysis. We propose a possible formation mechanism for the parasitic layer, and note that although the additional unintended layer may have beneficial aspects, we discuss a strategy to prevent its occurrence.
Original language | English |
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Article number | 083706 |
Journal | Journal of Applied Physics |
Volume | 107 |
Issue number | 8 |
DOIs | |
State | Published - Apr 15 2010 |
Externally published | Yes |
Funding
This work was supported by the Air Force Office of Scientific Research (Program monitor: Dr. Kitt Reinhardt) and Wright Patterson Air Force Base (Program monitor: Dr. Chris Bozada). The work at UM was supported by the NSF through Grant No. DMR-0606039. We also acknowledge use of facilities at the John M. Cowley Center for High Resolution Electron Microscopy at Arizona State University.
Funders | Funder number |
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Wright Patterson Air Force Base | |
National Science Foundation | DMR-0606039 |
Air Force Office of Scientific Research |