Application of thermoelastic lamination theory to predict warpage of a symmetric and simply supported printed wiring board during temperature cycling

Y. Polsky; C. Ume; W. Sutherlin

doi:10.1109/ECTC.1998.678717

Application of thermoelastic lamination theory to predict warpage of a symmetric and simply supported printed wiring board during temperature cycling

Y. Polsky, C. Ume, W. Sutherlin

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

The applicability of classical laminated plate theory to the prediction of thermally induced warpage of a printed wiring board is examined in this study. A bare, four-layer printed wiring board without traces has been constructed. The temperature-dependent mechanical properties of the board core materials have been measured. Closed form solutions of the differential equations of equilibrium for the classical lamination theory description of the board are obtained to predict warpage. The model accounts for material property change with temperature, the board's support conditions, and thermal gradients through the board thickness to assess the role of each in the warpage process. The warpage results predicted by the model are then compared to those obtained experimentally, using the shadow-moire technique in a simulated infrared reflow environment, to assess the model's accuracy.

Original language	English
Title of host publication	1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	345-352
Number of pages	8
ISBN (Print)	0780345266
DOIs	https://doi.org/10.1109/ECTC.1998.678717
State	Published - 1998
Externally published	Yes
Event	48th Electronic Components and Technology Conference, ECTC 1998 - Seattle, United States Duration: May 25 1998 → May 28 1998

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	Part F133492
ISSN (Print)	0569-5503

Conference

Conference	48th Electronic Components and Technology Conference, ECTC 1998
Country/Territory	United States
City	Seattle
Period	05/25/98 → 05/28/98

Funding

The authors would like to acknowledge the support of the Georgia Tech Manufacturing Research Center and the following organizations: Motorola, AT&T, Ford and Army Missile Command (MICOM).

Funders	Funder number
Ford and Army Missile Command
Georgia Tech Manufacturing Research Center
MICOM

Access to Document

10.1109/ECTC.1998.678717

Cite this

Polsky, Y., Ume, C., & Sutherlin, W. (1998). Application of thermoelastic lamination theory to predict warpage of a symmetric and simply supported printed wiring board during temperature cycling. In 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998 (pp. 345-352). Article 678717 (Proceedings - Electronic Components and Technology Conference; Vol. Part F133492). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.1998.678717

Polsky, Y. ; Ume, C. ; Sutherlin, W. / Application of thermoelastic lamination theory to predict warpage of a symmetric and simply supported printed wiring board during temperature cycling. 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998. Institute of Electrical and Electronics Engineers Inc., 1998. pp. 345-352 (Proceedings - Electronic Components and Technology Conference).

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title = "Application of thermoelastic lamination theory to predict warpage of a symmetric and simply supported printed wiring board during temperature cycling",

abstract = "The applicability of classical laminated plate theory to the prediction of thermally induced warpage of a printed wiring board is examined in this study. A bare, four-layer printed wiring board without traces has been constructed. The temperature-dependent mechanical properties of the board core materials have been measured. Closed form solutions of the differential equations of equilibrium for the classical lamination theory description of the board are obtained to predict warpage. The model accounts for material property change with temperature, the board's support conditions, and thermal gradients through the board thickness to assess the role of each in the warpage process. The warpage results predicted by the model are then compared to those obtained experimentally, using the shadow-moire technique in a simulated infrared reflow environment, to assess the model's accuracy.",

author = "Y. Polsky and C. Ume and W. Sutherlin",

note = "Publisher Copyright: {\textcopyright} 1998 IEEE.; 48th Electronic Components and Technology Conference, ECTC 1998 ; Conference date: 25-05-1998 Through 28-05-1998",

year = "1998",

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language = "English",

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Polsky, Y, Ume, C & Sutherlin, W 1998, Application of thermoelastic lamination theory to predict warpage of a symmetric and simply supported printed wiring board during temperature cycling. in 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998., 678717, Proceedings - Electronic Components and Technology Conference, vol. Part F133492, Institute of Electrical and Electronics Engineers Inc., pp. 345-352, 48th Electronic Components and Technology Conference, ECTC 1998, Seattle, United States, 05/25/98. https://doi.org/10.1109/ECTC.1998.678717

Application of thermoelastic lamination theory to predict warpage of a symmetric and simply supported printed wiring board during temperature cycling. / Polsky, Y.; Ume, C.; Sutherlin, W.
1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998. Institute of Electrical and Electronics Engineers Inc., 1998. p. 345-352 678717 (Proceedings - Electronic Components and Technology Conference; Vol. Part F133492).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - The applicability of classical laminated plate theory to the prediction of thermally induced warpage of a printed wiring board is examined in this study. A bare, four-layer printed wiring board without traces has been constructed. The temperature-dependent mechanical properties of the board core materials have been measured. Closed form solutions of the differential equations of equilibrium for the classical lamination theory description of the board are obtained to predict warpage. The model accounts for material property change with temperature, the board's support conditions, and thermal gradients through the board thickness to assess the role of each in the warpage process. The warpage results predicted by the model are then compared to those obtained experimentally, using the shadow-moire technique in a simulated infrared reflow environment, to assess the model's accuracy.

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Polsky Y, Ume C, Sutherlin W. Application of thermoelastic lamination theory to predict warpage of a symmetric and simply supported printed wiring board during temperature cycling. In 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998. Institute of Electrical and Electronics Engineers Inc. 1998. p. 345-352. 678717. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC.1998.678717

Application of thermoelastic lamination theory to predict warpage of a symmetric and simply supported printed wiring board during temperature cycling

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