Analytical approach for describing the collapse of surface asperities under compressive stress during rapid solid state bonding

Gaoqiang Chen; Zhili Feng; Jian Chen; Lei Liu; Han Li; Qu Liu; Shuai Zhang; Xiong Cao; Gong Zhang; Qingyu Shi

doi:10.1016/j.scriptamat.2016.10.015

Analytical approach for describing the collapse of surface asperities under compressive stress during rapid solid state bonding

Gaoqiang Chen, Zhili Feng, Jian Chen, Lei Liu, Han Li, Qu Liu, Shuai Zhang, Xiong Cao, Gong Zhang, Qingyu Shi

Materials Joining

Research output: Contribution to journal › Article › peer-review

40 Scopus citations

Abstract

Many material manufacturing technologies, such as friction stir welding, rely on rapid solid state bonding to join metal surfaces. In this letter, a differential equation is developed to formulate the growing of the interfacial bonded area owing to the collapse of surface asperities under compressive stress during rapid solid state bonding of metal surfaces. The effect of pressure, temperature and bonding time on the growing of bonded area is discussed. The proposed approach is verified by experimental data.

Original language	English
Pages (from-to)	41-44
Number of pages	4
Journal	Scripta Materialia
Volume	128
DOIs	https://doi.org/10.1016/j.scriptamat.2016.10.015
State	Published - Feb 1 2017

Funding

The work was supported by the National Natural Science Foundation of China (grant no. 51375259 ) and the National Science and Technology Major Project of the Ministry of Science and Technology of China (no. 2012ZX04012-011 ). Besides, Gaoqiang Chen was supported by the China Scholarship Council (file no. 20130620105) for 2-year study at Oak Ridge National Laboratory (Oak Ridge, TN, USA).

Funders	Funder number
National Natural Science Foundation of China	51375259
China Scholarship Council	20130620105
National Major Science and Technology Projects of China	2012ZX04012-011

Keywords

Plastic deformation
Solid state bonding
Strain rate
Surface asperities

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1016/j.scriptamat.2016.10.015

Cite this

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abstract = "Many material manufacturing technologies, such as friction stir welding, rely on rapid solid state bonding to join metal surfaces. In this letter, a differential equation is developed to formulate the growing of the interfacial bonded area owing to the collapse of surface asperities under compressive stress during rapid solid state bonding of metal surfaces. The effect of pressure, temperature and bonding time on the growing of bonded area is discussed. The proposed approach is verified by experimental data.",

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AU - Chen, Gaoqiang

AU - Feng, Zhili

AU - Chen, Jian

AU - Liu, Lei

AU - Li, Han

AU - Liu, Qu

AU - Zhang, Shuai

AU - Cao, Xiong

AU - Zhang, Gong

AU - Shi, Qingyu

PY - 2017/2/1

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N2 - Many material manufacturing technologies, such as friction stir welding, rely on rapid solid state bonding to join metal surfaces. In this letter, a differential equation is developed to formulate the growing of the interfacial bonded area owing to the collapse of surface asperities under compressive stress during rapid solid state bonding of metal surfaces. The effect of pressure, temperature and bonding time on the growing of bonded area is discussed. The proposed approach is verified by experimental data.

AB - Many material manufacturing technologies, such as friction stir welding, rely on rapid solid state bonding to join metal surfaces. In this letter, a differential equation is developed to formulate the growing of the interfacial bonded area owing to the collapse of surface asperities under compressive stress during rapid solid state bonding of metal surfaces. The effect of pressure, temperature and bonding time on the growing of bonded area is discussed. The proposed approach is verified by experimental data.

KW - Plastic deformation

KW - Solid state bonding

KW - Strain rate

KW - Surface asperities

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JO - Scripta Materialia

JF - Scripta Materialia

ER -

Analytical approach for describing the collapse of surface asperities under compressive stress during rapid solid state bonding

Abstract

Funding

Keywords

UN SDGs

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