Analysis on overall thermal resistance of laser diode beam combined modules

Zhijun Zhang; Yun Liu; Xihong Fu; Xiaonan Shan; Hongbo Zhu; Lijun Wang

doi:10.3788/CJL201239.0402010

Analysis on overall thermal resistance of laser diode beam combined modules

Zhijun Zhang, Yun Liu, Xihong Fu, Xiaonan Shan, Hongbo Zhu, Lijun Wang

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

Semiconductor laser cooling is to provide a low thermal resistance path between heat source and heat sink. Its main purpose is to reduce the external thermal resistance (resistance between the laser chip and the cooling space) to maintain a low temperature gradient and good thermal contact between the heating laser chip and cooling surface. Experimental methods are used to solve the problem of contact resistance according to the study object. Based on the single-chip combined beam module, a overall thermal resistance is analyzed gradually, software simulation and the frequency with red shift method are described for the thermal resistance of laser diode measurement. Single-chip combined beam module overall thermal resistance is less than 0.25°C/W. The cooling modules can be used in the 100 W-class semiconductor laser cooling requirements.

Original language	English
Article number	0402010
Pages (from-to)	1
Number of pages	1
Journal	Zhongguo Jiguang/Chinese Journal of Lasers
Volume	39
Issue number	4
DOIs	https://doi.org/10.3788/CJL201239.0402010
State	Published - Apr 2012

Keywords

Air cooling
Frequency red shift method
High-power semiconductor laser
Lasers
Thermal resistance

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10.3788/CJL201239.0402010

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title = "Analysis on overall thermal resistance of laser diode beam combined modules",

abstract = "Semiconductor laser cooling is to provide a low thermal resistance path between heat source and heat sink. Its main purpose is to reduce the external thermal resistance (resistance between the laser chip and the cooling space) to maintain a low temperature gradient and good thermal contact between the heating laser chip and cooling surface. Experimental methods are used to solve the problem of contact resistance according to the study object. Based on the single-chip combined beam module, a overall thermal resistance is analyzed gradually, software simulation and the frequency with red shift method are described for the thermal resistance of laser diode measurement. Single-chip combined beam module overall thermal resistance is less than 0.25°C/W. The cooling modules can be used in the 100 W-class semiconductor laser cooling requirements.",

keywords = "Air cooling, Frequency red shift method, High-power semiconductor laser, Lasers, Thermal resistance",

author = "Zhijun Zhang and Yun Liu and Xihong Fu and Xiaonan Shan and Hongbo Zhu and Lijun Wang",

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TY - JOUR

T1 - Analysis on overall thermal resistance of laser diode beam combined modules

AU - Zhang, Zhijun

AU - Liu, Yun

AU - Fu, Xihong

AU - Shan, Xiaonan

AU - Zhu, Hongbo

AU - Wang, Lijun

PY - 2012/4

Y1 - 2012/4

N2 - Semiconductor laser cooling is to provide a low thermal resistance path between heat source and heat sink. Its main purpose is to reduce the external thermal resistance (resistance between the laser chip and the cooling space) to maintain a low temperature gradient and good thermal contact between the heating laser chip and cooling surface. Experimental methods are used to solve the problem of contact resistance according to the study object. Based on the single-chip combined beam module, a overall thermal resistance is analyzed gradually, software simulation and the frequency with red shift method are described for the thermal resistance of laser diode measurement. Single-chip combined beam module overall thermal resistance is less than 0.25°C/W. The cooling modules can be used in the 100 W-class semiconductor laser cooling requirements.

AB - Semiconductor laser cooling is to provide a low thermal resistance path between heat source and heat sink. Its main purpose is to reduce the external thermal resistance (resistance between the laser chip and the cooling space) to maintain a low temperature gradient and good thermal contact between the heating laser chip and cooling surface. Experimental methods are used to solve the problem of contact resistance according to the study object. Based on the single-chip combined beam module, a overall thermal resistance is analyzed gradually, software simulation and the frequency with red shift method are described for the thermal resistance of laser diode measurement. Single-chip combined beam module overall thermal resistance is less than 0.25°C/W. The cooling modules can be used in the 100 W-class semiconductor laser cooling requirements.

KW - Air cooling

KW - Frequency red shift method

KW - High-power semiconductor laser

KW - Lasers

KW - Thermal resistance

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M3 - Article

AN - SCOPUS:84862328165

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SP - 1

JO - Zhongguo Jiguang/Chinese Journal of Lasers

JF - Zhongguo Jiguang/Chinese Journal of Lasers

IS - 4

M1 - 0402010

ER -

Analysis on overall thermal resistance of laser diode beam combined modules

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