Abstract
A semi-elliptical surface crack widely exists in the multilayered electronic devices, fibre reinforced laminated composites and solder joints. To ensure the safety of these structural components, three-dimensional interface fracture mechanics analysis is required. In this study, three-dimensional finite element analyses have been conducted to calculate the fracture mechanics parameters, including the stress intensity factors (SIFs), the strain energy release rate G and two phase angles ψ and φ for semi-elliptical interface surface cracks in finite thickness plates. A wide range of crack aspect ratios and relative depths are considered. The SIF computations are presented along the front of a three-dimensional bimaterial interface cracks with a/t values of 0.2, 0.4, 0.6 or 0.8 and a/c values of 0.2, 0.4, 0.6 or 1.0. In particular, far-field loads i.e., remote tension and bending, and various combinations of bimaterials are investigated. These fracture mechanics parameters’ solutions are suitable for fracture and fatigue life prediction for semi-elliptical bi-material interface surface cracks in engineering components.
| Original language | English |
|---|---|
| Pages (from-to) | 155-169 |
| Number of pages | 15 |
| Journal | Theoretical and Applied Fracture Mechanics |
| Volume | 93 |
| DOIs | |
| State | Published - Feb 2018 |
| Externally published | Yes |
Funding
The authors gratefully acknowledge the financial support from the National Natural Science Foundation of China (Nos. 51435012 and 51675373 ). XW’s work is also supported by Natural Sciences and Engineering Research Council (NSERC) of Canada .
| Funders | Funder number |
|---|---|
| Natural Sciences and Engineering Research Council of Canada | |
| National Natural Science Foundation of China | 51675373, 51435012 |
Keywords
- Interface cracks
- Semi-elliptical surface crack
- Strain energy release rate
- Stress intensity factors
- Three-dimensional finite element analysis