@inproceedings{63c6ef3ef4994063b61ab6fe3cf2bc2c,
title = "Analysis of copper treatments and the effects on signal propagation",
abstract = "As computer data rates increase into the 30 - 50 Gb/s range fundamental material challenges emerge that make it difficult to design a robust electrical interconnect between the transmitter and receiver. This paper discusses the effects of differing copper treatments and the effects these treatments have on signal propagation for a computer electrical interconnect. Two types of treatments have been studied: high profile copper (HPC) and low profile copper (LPC). Discussions on the physical surface geometry and elemental analyses of mese copper types along with their signaling effects are discussed below.",
author = "Pytel, {Steven G.} and Huray, {Paul G.} and Hall, {Stephen H.} and Mellitz, {Richard I.} and Gary Brist and Meyer, {Harry M.} and Larry Walker and Marc Garland",
year = "2008",
doi = "10.1109/ECTC.2008.4550120",
language = "English",
isbn = "9781424422302",
series = "Proceedings - Electronic Components and Technology Conference",
pages = "1144--1149",
booktitle = "2008 Proceedings 58th Electronic Components and Technology Conference, ECTC",
note = "2008 58th Electronic Components and Technology Conference, ECTC ; Conference date: 27-05-2008 Through 30-05-2008",
}