An X-ray radiography study of the effect of thermal cycling on damage evolution in large-area Sn-3.5Ag solder joints

There is a need for next-generation, high-performance power electronic packages and systems utilizing wide-band-gap devices to operate at high temperatures in automotive and electricity transmission applications. Sn-3.5Ag solder is a candidate for use in such packages with potential maximum operating temperatures of about 200 C. However, there is a need to understand the thermal cycling reliability of Sn-3.5Ag solders subject to such high-temperature operating conditions. The results of a study on the damage evolution occurring in large-area Sn-3.5Ag solder joints between silicon dies and direct bonded copper substrates with Au/Ni-P metallization subject to thermal cycling between 200 C and 5 C are presented in this paper. Interface structure evolution and damage accumulation were followed using high-resolution X-ray radiography, cross-sectional optical and scanning electron microscopies, and X-ray microanalysis in these joints for up to 3000 thermal cycles. Optical and scanning electron microscopy results showed that the stresses introduced by the thermal cycling result in cracking and delamination at the copper-intermetallic compound interface. X-ray microanalysis showed that stresses due to thermal cycling resulted in physical cracking and breakdown of the Ni-P barrier layer, facilitating Cu-Sn interdiffusion. This interdiffusion resulted in the formation of Cu-Sn intermetallic compounds underneath the Ni-P layer, subsequently leading to delamination between the Ni-rich layer and Cu-Sn intermetallic compounds.