Abstract
Wicking structures have been widely used within passive heat transfer devices with high heat fluxes, such as heat pipes, to enhance their thermal performance. While wicking structures promote capillary pumping of the working fluid and thin film evaporation, they can result in capillary evaporation and further enhance the evaporation heat transfer. In this study, a 0.5 mm thick layer of 105 µm sintered copper particles was added to the inner wall of a copper tube, aiming to form an “annular flow” and enhance the heat transfer characteristics by taking advantage of thin film and capillary evaporation. Acetone was chosen as the working fluid, and the performance of an evaporation tube was tested for power inputs of 10, 30, 50, and 70 W. For each power input, trials were run at inclination angles varying from −90 deg to 90 deg to investigate the capillary effects. The temperature measurements showed that the temperature distribution along the evaporation tube is always downward sloping, meaning the temperature at the fluid inlet is larger than the outlet. Results show that an “annular flow” formed by a thin layer of sintered particles can promote thin film and capillary evaporation and, therefore, boost the evaporation heat transfer coefficient.
| Original language | English |
|---|---|
| Article number | 071001 |
| Journal | Journal of Thermal Science and Engineering Applications |
| Volume | 16 |
| Issue number | 7 |
| DOIs | |
| State | Published - Jul 1 2024 |
Funding
This work is in part a work of the U.S. Government. ASME disclaims all interest in the U.S. Government's contributions. The work presented in this article was supported by the Office of Naval Research Grant No. N00014-19-1-2006, under the direction of Dr. Mark Spector. This material is based upon work supported by the U.S. Department of Energy (DOE), Office of Science, Building Technologies Office. This research used resources of the Building Technologies Research and Integration Center (BTRIC) of the Oak Ridge National Laboratory, which is a DOE Office of Science User Facility.
Keywords
- copper sintered particles
- evaporation
- heat pipes
- heat transfer
- porous media