All-inverter complementary metal oxide semiconductor based dose control circuit for using vertically aligned carbon nanofibers in maskless lithography

S. K. Islam, C. Durisety, R. Vijayaraghavan, B. J. Blalock, T. Grundman, L. R. Baylor, W. L. Gardner

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Abstract

This article presents a prototype implementation of a circuit that can control charge emission from the vertically aligned carbon nanofibers (VACNFs), for use in the implementation of digital electrostatically focused e-beam array direct-write lithography. This lithography technique can be used to fabricate ultra-small feature size devices, while cutting down the manufacturing costs of photomasks [Baylor, J. Vac. Sci. Technol. B 20, 2646 (2002)]. These VACNFs are found to be quite robust for use as microfabricated field-emission devices [Bolton, Sens. Actuators B 85, 179 (2002)]. The all-inverter based dose control circuit presented in this article was fabricated using a standard 0.5 μm complementary metal oxide semiconductor process to improve the dose-rate accuracy, when using these VACNFs for etching in maskless lithography. Simulation and measurement results are compared and analyzed, and future work for improving the design is discussed.

Original languageEnglish
Pages (from-to)1026-1029
Number of pages4
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume24
Issue number2
DOIs
StatePublished - Mar 2006

Funding

This research was sponsored by the Defense Advanced Research Projects Agency (DARPA) under Contract No. DARPA-MIPR-97-1357.

FundersFunder number
Defense Advanced Research Projects AgencyDARPA-MIPR-97-1357

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