TY - JOUR
T1 - Advancements in 3D printing and hot isostatic pressing of copper
T2 - bridging the gap between green and sintered states for enhanced mechanical and electrical properties
AU - Ajjarapu, Kameswara Pavan Kumar
AU - Barber, Carrie
AU - Taylor, James
AU - Pelletiers, Thomas
AU - Jackson, Douglas
AU - Beamer, Chad
AU - Atre, Sundar V.
AU - Kate, Kunal H.
N1 - Publisher Copyright:
© The Author(s), under exclusive licence to Springer Nature Switzerland AG 2024.
PY - 2024
Y1 - 2024
N2 - This paper investigates the advancements and challenges in 3D printing, sintering, and hot isostatic pressing (HIP) of copper parts. It showcases the viability of employing bound powder copper feedstocks with a 61 vol.% loading, which undergo compounding, extrusion into filaments, and processing through Material Extrusion (MEX) 3D printing, achieving properties comparable to conventional Metal Injection Molding (MIM). Incorporating pre-sintering holds in a reducing atmosphere alongside HIP resulted in remarkable mechanical and electrical properties. Specifically, sintered parts display a 14.6% linear shrinkage, slightly increasing to 15.6% post-HIP. Sintering yields 93% relative density, with HIP further enhancing it to 98% relative to pure copper. HIPed copper parts exhibit improved mechanical characteristics, with ultimate tensile strength escalating from 170 to 190 MPa, and elongation at failure augmenting from 23 to 32%, denoting heightened ductility. The enhancement of Young’s modulus from 35 to 75GPa indicates increased stiffness post-HIP. In addition, electrical conductivity rises from 86% IACS to 100% IACS from sintered to HIP stages. This behavior could be attributed to possible reduction in surface oxide layers during sintering and grain coarsening, reinforcing ductility, and electrical properties in HIPed samples. This study is at the forefront of presenting superior mechanical and electrical attributes through copper 3D printing, offering a pathway for advancing both 3D printing and HIPing as a viable strategy for crafting high-performance copper components across electronics, aerospace, and automotive sectors.
AB - This paper investigates the advancements and challenges in 3D printing, sintering, and hot isostatic pressing (HIP) of copper parts. It showcases the viability of employing bound powder copper feedstocks with a 61 vol.% loading, which undergo compounding, extrusion into filaments, and processing through Material Extrusion (MEX) 3D printing, achieving properties comparable to conventional Metal Injection Molding (MIM). Incorporating pre-sintering holds in a reducing atmosphere alongside HIP resulted in remarkable mechanical and electrical properties. Specifically, sintered parts display a 14.6% linear shrinkage, slightly increasing to 15.6% post-HIP. Sintering yields 93% relative density, with HIP further enhancing it to 98% relative to pure copper. HIPed copper parts exhibit improved mechanical characteristics, with ultimate tensile strength escalating from 170 to 190 MPa, and elongation at failure augmenting from 23 to 32%, denoting heightened ductility. The enhancement of Young’s modulus from 35 to 75GPa indicates increased stiffness post-HIP. In addition, electrical conductivity rises from 86% IACS to 100% IACS from sintered to HIP stages. This behavior could be attributed to possible reduction in surface oxide layers during sintering and grain coarsening, reinforcing ductility, and electrical properties in HIPed samples. This study is at the forefront of presenting superior mechanical and electrical attributes through copper 3D printing, offering a pathway for advancing both 3D printing and HIPing as a viable strategy for crafting high-performance copper components across electronics, aerospace, and automotive sectors.
KW - 3D printing
KW - Copper
KW - Electrical property
KW - Hot isostatic pressing
KW - Microstructure
KW - Sintering
UR - http://www.scopus.com/inward/record.url?scp=85189357827&partnerID=8YFLogxK
U2 - 10.1007/s40964-024-00585-1
DO - 10.1007/s40964-024-00585-1
M3 - Article
AN - SCOPUS:85189357827
SN - 2363-9512
JO - Progress in Additive Manufacturing
JF - Progress in Additive Manufacturing
ER -