Advancements in 3D printing and hot isostatic pressing of copper: bridging the gap between green and sintered states for enhanced mechanical and electrical properties

Kameswara Pavan Kumar Ajjarapu, Carrie Barber, James Taylor, Thomas Pelletiers, Douglas Jackson, Chad Beamer, Sundar V. Atre, Kunal H. Kate

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

This paper investigates the advancements and challenges in 3D printing, sintering, and hot isostatic pressing (HIP) of copper parts. It showcases the viability of employing bound powder copper feedstocks with a 61 vol.% loading, which undergo compounding, extrusion into filaments, and processing through Material Extrusion (MEX) 3D printing, achieving properties comparable to conventional Metal Injection Molding (MIM). Incorporating pre-sintering holds in a reducing atmosphere alongside HIP resulted in remarkable mechanical and electrical properties. Specifically, sintered parts display a 14.6% linear shrinkage, slightly increasing to 15.6% post-HIP. Sintering yields 93% relative density, with HIP further enhancing it to 98% relative to pure copper. HIPed copper parts exhibit improved mechanical characteristics, with ultimate tensile strength escalating from 170 to 190 MPa, and elongation at failure augmenting from 23 to 32%, denoting heightened ductility. The enhancement of Young’s modulus from 35 to 75GPa indicates increased stiffness post-HIP. In addition, electrical conductivity rises from 86% IACS to 100% IACS from sintered to HIP stages. This behavior could be attributed to possible reduction in surface oxide layers during sintering and grain coarsening, reinforcing ductility, and electrical properties in HIPed samples. This study is at the forefront of presenting superior mechanical and electrical attributes through copper 3D printing, offering a pathway for advancing both 3D printing and HIPing as a viable strategy for crafting high-performance copper components across electronics, aerospace, and automotive sectors.

Original languageEnglish
JournalProgress in Additive Manufacturing
DOIs
StateAccepted/In press - 2024
Externally publishedYes

Keywords

  • 3D printing
  • Copper
  • Electrical property
  • Hot isostatic pressing
  • Microstructure
  • Sintering

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