Advanced Manufacturing of Printed Melt Wire Chips for Cheap, Compact Passive In-Pile Temperature Sensors

Kunal Mondal, Kiyo Fujimoto, Michael D. McMurtrey

Research output: Contribution to journalArticlepeer-review

10 Scopus citations

Abstract

Melt wires are a passive sensor used to determine peak temperatures. Traditional melt wires are commonly used in test reactor experiments, such as in the Advanced Test Reactor. However, the conditions within a reactor present significant challenges towards test design, due to space limitations and the harsh environment. For example, some test capsules have only a couple millimeters in diameter available for instrumentation, which is too small to accommodate a traditional melt wire package. To enable instrumentation for space-limited applications, peak temperature sensors have been developed using additive manufacture to form printed melt wires. This paper reports on the design and fabrication of miniaturized melt wire chips with printed melt wires. This study advances the development of unique, compact temperature sensors capable of sensing user specified temperature ranges within the harsh environment of irradiation testing.

Original languageEnglish
Pages (from-to)4196-4201
Number of pages6
JournalJOM
Volume72
Issue number12
DOIs
StatePublished - Dec 2020

Funding

This work was supported through the Department of Energy In-Pile Instrumentation program, under the US Department of Energy Nuclear Energy Enabling Technology Advanced Sensors and Instrumentation program. The authors gratefully acknowledge Robert D. Seifert, Arnold W. Erickson, Wilson R. Lloyd, Troy C. Unruh, and Ashley A. Lambson at the Idaho National Laboratory for their help in characterization, sample preparation, furnace test, and useful discussions. Authors also acknowledge and thank Travis Gabel and Microfabrication laboratory at Boise State University for their help in fabricating the printed melt wires. This work was supported through the Department of Energy In-Pile Instrumentation program, under the US Department of Energy Nuclear Energy Enabling Technology Advanced Sensors and Instrumentation program. The authors gratefully acknowledge Robert D. Seifert, Arnold W. Erickson, Wilson R. Lloyd, Troy C. Unruh, and Ashley A. Lambson at the Idaho National Laboratory for their help in characterization, sample preparation, furnace test, and useful discussions. Authors also acknowledge and thank Travis Gabel and Microfabrication laboratory at Boise State University for their help in fabricating the printed melt wires.

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