Adhesive bonding/joining via exposure to microwave radiation

Felix L. Paulauskas; C. David Warren; Thomas T. Meek

Adhesive bonding/joining via exposure to microwave radiation

Felix L. Paulauskas, C. David Warren, Thomas T. Meek

Carbon and Composites

Research output: Contribution to conference › Paper › peer-review

2 Scopus citations

Abstract

Adhesive bonding through microwave radiation curing was evaluated as an alternative processing technology. This technique significantly reduces the required curing time for the adhesive while maintaining, equivalent physical characteristics as the adhesive material is cured or polymerized (crosslinked). This results in an improvement in the economics of the process.

Original language	English
Pages	114-124
Number of pages	11
State	Published - 1995
Event	Proceedings of the 1995 27th International SAMPE Technical Conference - Albuquerque, NM, USA Duration: Oct 9 1995 → Oct 12 1995

Conference

Conference	Proceedings of the 1995 27th International SAMPE Technical Conference
City	Albuquerque, NM, USA
Period	10/9/95 → 10/12/95

Cite this

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title = "Adhesive bonding/joining via exposure to microwave radiation",

abstract = "Adhesive bonding through microwave radiation curing was evaluated as an alternative processing technology. This technique significantly reduces the required curing time for the adhesive while maintaining, equivalent physical characteristics as the adhesive material is cured or polymerized (crosslinked). This results in an improvement in the economics of the process.",

author = "Paulauskas, {Felix L.} and Warren, {C. David} and Meek, {Thomas T.}",

year = "1995",

language = "English",

pages = "114--124",

note = "Proceedings of the 1995 27th International SAMPE Technical Conference ; Conference date: 09-10-1995 Through 12-10-1995",

}

TY - CONF

T1 - Adhesive bonding/joining via exposure to microwave radiation

AU - Paulauskas, Felix L.

AU - Warren, C. David

AU - Meek, Thomas T.

PY - 1995

Y1 - 1995

N2 - Adhesive bonding through microwave radiation curing was evaluated as an alternative processing technology. This technique significantly reduces the required curing time for the adhesive while maintaining, equivalent physical characteristics as the adhesive material is cured or polymerized (crosslinked). This results in an improvement in the economics of the process.

AB - Adhesive bonding through microwave radiation curing was evaluated as an alternative processing technology. This technique significantly reduces the required curing time for the adhesive while maintaining, equivalent physical characteristics as the adhesive material is cured or polymerized (crosslinked). This results in an improvement in the economics of the process.

UR - http://www.scopus.com/inward/record.url?scp=0029459343&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0029459343

SP - 114

EP - 124

T2 - Proceedings of the 1995 27th International SAMPE Technical Conference

Y2 - 9 October 1995 through 12 October 1995

ER -

Adhesive bonding/joining via exposure to microwave radiation

Abstract

Conference

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