Abstract
Direct additive manufacturing method utilizing electron beam melting techniques was employed to produce fully dense oxygen free copper W-band waveguides. By employing smaller copper powder, finer deposition layer, and spot-melting methodology surface roughness average has been reduced from 44 μm to 28 μm. A magnetically driven abrasive process was then employed to demonstrate further surface roughness average improvement of 5 μm. Initial RF test results on as-printed WR-10 waveguide confirm that surface post-processing will be essential to implementation of additive manufacturing techniques in vacuum electronics.
Original language | English |
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Title of host publication | 2018 IEEE International Vacuum Electronics Conference, IVEC 2018 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 409-410 |
Number of pages | 2 |
ISBN (Electronic) | 9781538604540 |
DOIs | |
State | Published - Jun 20 2018 |
Externally published | Yes |
Event | 19th IEEE International Vacuum Electronics Conference, IVEC 2018 - Monterey, United States Duration: Apr 23 2018 → Apr 26 2018 |
Publication series
Name | 2018 IEEE International Vacuum Electronics Conference, IVEC 2018 |
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Conference
Conference | 19th IEEE International Vacuum Electronics Conference, IVEC 2018 |
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Country/Territory | United States |
City | Monterey |
Period | 04/23/18 → 04/26/18 |
Funding
This work was funded by DARPA INVEST program under Contract N66001-16-1-4044. White Light Interferometry conducted by Dr. Chris Evans at UNC Charlotte.
Keywords
- W-band
- additive manufacturing
- electron beam melting
- oxygen free copper
- surface roughness