TY - GEN
T1 - Additively manufactured WR-10 copper waveguide
AU - Horn, Timothy
AU - Karakurt, Ilbey
AU - Ledford, Christopher
AU - Gonzalez, Michelle
AU - Gamzina, Diana
AU - Luhmann, Neville C.
AU - Lin, Liwei
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/6/20
Y1 - 2018/6/20
N2 - Direct additive manufacturing method utilizing electron beam melting techniques was employed to produce fully dense oxygen free copper W-band waveguides. By employing smaller copper powder, finer deposition layer, and spot-melting methodology surface roughness average has been reduced from 44 μm to 28 μm. A magnetically driven abrasive process was then employed to demonstrate further surface roughness average improvement of 5 μm. Initial RF test results on as-printed WR-10 waveguide confirm that surface post-processing will be essential to implementation of additive manufacturing techniques in vacuum electronics.
AB - Direct additive manufacturing method utilizing electron beam melting techniques was employed to produce fully dense oxygen free copper W-band waveguides. By employing smaller copper powder, finer deposition layer, and spot-melting methodology surface roughness average has been reduced from 44 μm to 28 μm. A magnetically driven abrasive process was then employed to demonstrate further surface roughness average improvement of 5 μm. Initial RF test results on as-printed WR-10 waveguide confirm that surface post-processing will be essential to implementation of additive manufacturing techniques in vacuum electronics.
KW - W-band
KW - additive manufacturing
KW - electron beam melting
KW - oxygen free copper
KW - surface roughness
UR - http://www.scopus.com/inward/record.url?scp=85050033664&partnerID=8YFLogxK
U2 - 10.1109/IVEC.2018.8391526
DO - 10.1109/IVEC.2018.8391526
M3 - Conference contribution
AN - SCOPUS:85050033664
T3 - 2018 IEEE International Vacuum Electronics Conference, IVEC 2018
SP - 409
EP - 410
BT - 2018 IEEE International Vacuum Electronics Conference, IVEC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 19th IEEE International Vacuum Electronics Conference, IVEC 2018
Y2 - 23 April 2018 through 26 April 2018
ER -