Additive vacuum electronics: Electron beam melting of copper

D. Gamzina; N. C. Luhmann; C. Ledford; T. Horn; I. Karakaut; L. Lin; P. Frigola

doi:10.1109/IVEC.2017.8289495

Additive vacuum electronics: Electron beam melting of copper

D. Gamzina, N. C. Luhmann, C. Ledford, T. Horn, I. Karakaut, L. Lin, P. Frigola

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

16 Scopus citations

Abstract

The construction of vacuum electronic devices is an artisan process; it requires extremes of high precision machining and assembly and the tolerances and feature sizes become more exacting as the frequency increases. Merging of copper additive manufacturing and electropolishing technologies will produce low-cost, high-throughput fabrication techniques for construction of fully integrated vacuum electronic devices. Technology demonstrations at two frequencies (S-Band and W-band) will address the demand for fast turnaround manufacturing of travelling wave tube amplifiers in legacy military systems as well as in the emerging high frequency applications.

Original language	English
Title of host publication	IVEC 2017 - 18th International Vacuum Electronics Conference
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1-2
Number of pages	2
ISBN (Electronic)	9781509059157
DOIs	https://doi.org/10.1109/IVEC.2017.8289495
State	Published - Jul 2 2017
Externally published	Yes
Event	18th International Vacuum Electronics Conference, IVEC 2017 - London, United Kingdom Duration: Apr 24 2017 → Apr 26 2017

Publication series

Name	IVEC 2017 - 18th International Vacuum Electronics Conference
Volume	2018-January

Conference

Conference	18th International Vacuum Electronics Conference, IVEC 2017
Country/Territory	United Kingdom
City	London
Period	04/24/17 → 04/26/17

Funding

This work was supported by the DARPA INVEST program, Contract N66001-16-1-4044 and by NSWD-Crane, STTR program, Contract N0025316P0261.

Funders	Funder number
NSWD-Crane	N0025316P0261
Defense Advanced Research Projects Agency	N66001-16-1-4044

Keywords

Additive manufacturing
S-band
TWT
Vacuum electronics
W-band

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1109/IVEC.2017.8289495

Cite this

Gamzina, D., Luhmann, N. C., Ledford, C., Horn, T., Karakaut, I., Lin, L., & Frigola, P. (2017). Additive vacuum electronics: Electron beam melting of copper. In IVEC 2017 - 18th International Vacuum Electronics Conference (pp. 1-2). (IVEC 2017 - 18th International Vacuum Electronics Conference; Vol. 2018-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IVEC.2017.8289495

@inproceedings{3d602f8675b440628558aae62c257bd4,

title = "Additive vacuum electronics: Electron beam melting of copper",

abstract = "The construction of vacuum electronic devices is an artisan process; it requires extremes of high precision machining and assembly and the tolerances and feature sizes become more exacting as the frequency increases. Merging of copper additive manufacturing and electropolishing technologies will produce low-cost, high-throughput fabrication techniques for construction of fully integrated vacuum electronic devices. Technology demonstrations at two frequencies (S-Band and W-band) will address the demand for fast turnaround manufacturing of travelling wave tube amplifiers in legacy military systems as well as in the emerging high frequency applications.",

keywords = "Additive manufacturing, S-band, TWT, Vacuum electronics, W-band",

author = "D. Gamzina and Luhmann, {N. C.} and C. Ledford and T. Horn and I. Karakaut and L. Lin and P. Frigola",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 18th International Vacuum Electronics Conference, IVEC 2017 ; Conference date: 24-04-2017 Through 26-04-2017",

year = "2017",

month = jul,

day = "2",

doi = "10.1109/IVEC.2017.8289495",

language = "English",

series = "IVEC 2017 - 18th International Vacuum Electronics Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1--2",

booktitle = "IVEC 2017 - 18th International Vacuum Electronics Conference",

}

Gamzina, D, Luhmann, NC, Ledford, C, Horn, T, Karakaut, I, Lin, L & Frigola, P 2017, Additive vacuum electronics: Electron beam melting of copper. in IVEC 2017 - 18th International Vacuum Electronics Conference. IVEC 2017 - 18th International Vacuum Electronics Conference, vol. 2018-January, Institute of Electrical and Electronics Engineers Inc., pp. 1-2, 18th International Vacuum Electronics Conference, IVEC 2017, London, United Kingdom, 04/24/17. https://doi.org/10.1109/IVEC.2017.8289495

Additive vacuum electronics: Electron beam melting of copper. / Gamzina, D.; Luhmann, N. C.; Ledford, C. et al.
IVEC 2017 - 18th International Vacuum Electronics Conference. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1-2 (IVEC 2017 - 18th International Vacuum Electronics Conference; Vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Additive vacuum electronics

T2 - 18th International Vacuum Electronics Conference, IVEC 2017

AU - Gamzina, D.

AU - Luhmann, N. C.

AU - Ledford, C.

AU - Horn, T.

AU - Karakaut, I.

AU - Lin, L.

AU - Frigola, P.

PY - 2017/7/2

Y1 - 2017/7/2

N2 - The construction of vacuum electronic devices is an artisan process; it requires extremes of high precision machining and assembly and the tolerances and feature sizes become more exacting as the frequency increases. Merging of copper additive manufacturing and electropolishing technologies will produce low-cost, high-throughput fabrication techniques for construction of fully integrated vacuum electronic devices. Technology demonstrations at two frequencies (S-Band and W-band) will address the demand for fast turnaround manufacturing of travelling wave tube amplifiers in legacy military systems as well as in the emerging high frequency applications.

AB - The construction of vacuum electronic devices is an artisan process; it requires extremes of high precision machining and assembly and the tolerances and feature sizes become more exacting as the frequency increases. Merging of copper additive manufacturing and electropolishing technologies will produce low-cost, high-throughput fabrication techniques for construction of fully integrated vacuum electronic devices. Technology demonstrations at two frequencies (S-Band and W-band) will address the demand for fast turnaround manufacturing of travelling wave tube amplifiers in legacy military systems as well as in the emerging high frequency applications.

KW - Additive manufacturing

KW - S-band

KW - TWT

KW - Vacuum electronics

KW - W-band

UR - http://www.scopus.com/inward/record.url?scp=85049160693&partnerID=8YFLogxK

U2 - 10.1109/IVEC.2017.8289495

DO - 10.1109/IVEC.2017.8289495

M3 - Conference contribution

AN - SCOPUS:85049160693

T3 - IVEC 2017 - 18th International Vacuum Electronics Conference

SP - 1

EP - 2

BT - IVEC 2017 - 18th International Vacuum Electronics Conference

PB - Institute of Electrical and Electronics Engineers Inc.

Y2 - 24 April 2017 through 26 April 2017

ER -

Additive vacuum electronics: Electron beam melting of copper

Abstract

Publication series

Conference

Funding

Keywords

UN SDGs

Access to Document

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