Abstract
Solid state nature of additive friction stir deposition (AFSD) additive manufacturing process is very advantageous in terms of defect formation and microstructural refinement in the material. Current study presents the process optimization, microstructural evolution and kinetics of recrystallization for AFSD deposited low stacking fault energy material - SS316. As deposited microstructure shows equiaxed ultra fine grains with an average grain size of ∼5.0 ± 0.5 μm. Shear deformation at high temperature during processing leads to the operation of restoration mechanisms. Observation of necklace type microstructure in the as deposited SS316 is attributed to discontinuous dynamic recrystallization during processing. Recrystallization kinetics of the AFSD SS316 is characterized using Johnson-Mehl-Avarami-Kolmogorov (JMAK) model. Deformation – thermal cycling during AFSD process resulted in inconsistent recrystallization kinetics. Variation in strain, strain rate and temperature during processing with processing parameters result in varying microstructure and tool wear. High strength-ductility combination and sustained work hardening in as deposited SS316 appear to arise from transformation and twinning during deformation, leading to the formation of hierarchical twins and martensitic phase after deformation.
Original language | English |
---|---|
Article number | 112470 |
Journal | Materials Characterization |
Volume | 195 |
DOIs | |
State | Published - Jan 2023 |
Externally published | Yes |
Funding
The authors acknowledge the infrastructure and support of Center for Agile & Adaptive and Additive Manufacturing ( CAAAM ) funded through State of Texas Appropriation #190405-105-805008-220. The authors thank Materials Research Facility for access to microscopy facilities at the University of North Texas. PA is also grateful to Dr. Abhishek Sharma and Dr. Sriswaroop Dasari for their help with TEM and FIB.
Keywords
- Additive friction stir deposition
- Additive manufacturing
- Deformation mechanism
- Microstructure
- Recrystallization kinetics