Abstract
Heat sinks for desktop computers and other electronic equipment were described. The cooling technique is suitable for systems where the chip or electronic device can be bonded directly to the graphite foam and then immersed in the cooling fluid. The design of heat sink is simple and comprises of an aluminum housing, foam bonded to the base of housing, and a condenser lid. Tests were conducted by incrementally increasing power to the heater, and the internal vapor temperature, the interface temperature and the heater temperature were recorded.
| Original language | English |
|---|---|
| Pages (from-to) | 638-640 |
| Number of pages | 3 |
| Journal | IEEE Transactions on Device and Materials Reliability |
| Volume | 4 |
| Issue number | 4 |
| DOIs | |
| State | Published - Dec 2004 |
Funding
Manuscript received August 22, 2004. This work was supported by the National Security Agency and the Missile Defense Agency under Contracts 1651-S563-A1 and 2347-S534-A1, respectively. The authors are with Metals and Ceramics Division, Oak Ridge National Laboratory, Oak Ridge, TN, 37831 USA (e-mail: [email protected]). Digital Object Identifier 10.1109/TDMR.2004.836731 1[Online.] Available: http://www.dansdata.com/coolercomp_p9.htm#mcxp4. 2003.