Abstract
Plasma-activated sintering (PAS) has been applied, for the first time, to join magnesium and aluminum using a CuNi/Ag/CuNi sandwich structural interlayer. A cleaning effect and high efficient plasma heating mode in PAS have contributed to forming a strong interfacial diffusion bond under low temperature 673 K (400 °C) and short dwell time (0.6 ks). The designed interlayer provides a diffusion barrier effect and an enhanced physical contact between the interfaces. Strong bonding has been achieved without forming the brittle Mg-Al intermetallics.
| Original language | English |
|---|---|
| Pages (from-to) | 631-636 |
| Number of pages | 6 |
| Journal | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science |
| Volume | 47 |
| Issue number | 2 |
| DOIs | |
| State | Published - Feb 1 2016 |
| Externally published | Yes |
Funding
The authors gratefully acknowledge the financial support from the National Natural Science Foundation of China (No. 51202175), the 111 Project (B13035) of China, the Nature Science Foundation of Hubei Province (Nos. 2014CFB257, 2014CFB258), and the China Scholarship Council.