Accelerated Bonding of Magnesium and Aluminum with a CuNi/Ag/CuNi Sandwich Interlayer by Plasma-Activated Sintering

Yiyu Wang; Mei Rao; Leijun Li; Guoqiang Luo; Qiang Shen; Lianmeng Zhang

doi:10.1007/s11661-015-3223-7

Accelerated Bonding of Magnesium and Aluminum with a CuNi/Ag/CuNi Sandwich Interlayer by Plasma-Activated Sintering

Yiyu Wang, Mei Rao, Leijun Li, Guoqiang Luo, Qiang Shen, Lianmeng Zhang

Research output: Contribution to journal › Article › peer-review

18 Scopus citations

Abstract

Plasma-activated sintering (PAS) has been applied, for the first time, to join magnesium and aluminum using a CuNi/Ag/CuNi sandwich structural interlayer. A cleaning effect and high efficient plasma heating mode in PAS have contributed to forming a strong interfacial diffusion bond under low temperature 673 K (400 °C) and short dwell time (0.6 ks). The designed interlayer provides a diffusion barrier effect and an enhanced physical contact between the interfaces. Strong bonding has been achieved without forming the brittle Mg-Al intermetallics.

Original language	English
Pages (from-to)	631-636
Number of pages	6
Journal	Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Volume	47
Issue number	2
DOIs	https://doi.org/10.1007/s11661-015-3223-7
State	Published - Feb 1 2016
Externally published	Yes

Funding

The authors gratefully acknowledge the financial support from the National Natural Science Foundation of China (No. 51202175), the 111 Project (B13035) of China, the Nature Science Foundation of Hubei Province (Nos. 2014CFB257, 2014CFB258), and the China Scholarship Council.

Funders	Funder number
National Natural Science Foundation of China	51202175
Natural Science Foundation of Hubei Province	2014CFB257, 2014CFB258
China Scholarship Council
Higher Education Discipline Innovation Project	B13035

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title = "Accelerated Bonding of Magnesium and Aluminum with a CuNi/Ag/CuNi Sandwich Interlayer by Plasma-Activated Sintering",

abstract = "Plasma-activated sintering (PAS) has been applied, for the first time, to join magnesium and aluminum using a CuNi/Ag/CuNi sandwich structural interlayer. A cleaning effect and high efficient plasma heating mode in PAS have contributed to forming a strong interfacial diffusion bond under low temperature 673 K (400 °C) and short dwell time (0.6 ks). The designed interlayer provides a diffusion barrier effect and an enhanced physical contact between the interfaces. Strong bonding has been achieved without forming the brittle Mg-Al intermetallics.",

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T1 - Accelerated Bonding of Magnesium and Aluminum with a CuNi/Ag/CuNi Sandwich Interlayer by Plasma-Activated Sintering

AU - Wang, Yiyu

AU - Rao, Mei

AU - Li, Leijun

AU - Luo, Guoqiang

AU - Shen, Qiang

AU - Zhang, Lianmeng

PY - 2016/2/1

Y1 - 2016/2/1

N2 - Plasma-activated sintering (PAS) has been applied, for the first time, to join magnesium and aluminum using a CuNi/Ag/CuNi sandwich structural interlayer. A cleaning effect and high efficient plasma heating mode in PAS have contributed to forming a strong interfacial diffusion bond under low temperature 673 K (400 °C) and short dwell time (0.6 ks). The designed interlayer provides a diffusion barrier effect and an enhanced physical contact between the interfaces. Strong bonding has been achieved without forming the brittle Mg-Al intermetallics.

AB - Plasma-activated sintering (PAS) has been applied, for the first time, to join magnesium and aluminum using a CuNi/Ag/CuNi sandwich structural interlayer. A cleaning effect and high efficient plasma heating mode in PAS have contributed to forming a strong interfacial diffusion bond under low temperature 673 K (400 °C) and short dwell time (0.6 ks). The designed interlayer provides a diffusion barrier effect and an enhanced physical contact between the interfaces. Strong bonding has been achieved without forming the brittle Mg-Al intermetallics.

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ER -

Accelerated Bonding of Magnesium and Aluminum with a CuNi/Ag/CuNi Sandwich Interlayer by Plasma-Activated Sintering

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