A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications

Ranjan R. Lamichhane, Nance Ericsson, Shane Frank, Chuck Britton, Laura Marlino, Alan Mantooth, Matt Francis, Paul Shepherd, Michael Glover, Sonia Perez, Ty McNutt, Bret Whitaker, Zach Cole

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

52 Scopus citations

Abstract

Limitations of silicon (Si) based power electronic devices can be overcome with Silicon Carbide (SiC) because of its remarkable material properties. SiC is a wide bandgap semiconductor material with larger bandgap, lower leakage currents, higher breakdown electric field, and higher thermal conductivity, which promotes higher switching frequencies for high power applications, higher temperature operation, and results in higher power density devices relative to Si [1]. The proposed work is focused on design of a SiC gate driver to drive a SiC power MOSFET, on a Cree SiC process, with rise/fall times (less than 100 ns) suitable for 500 kHz to 1 MHz switching frequency applications. A process optimized gate driver topology design which is significantly different from generic Si circuit design is proposed. The ultimate goal of the project is to integrate this gate driver into a Toyota Prius plug-in hybrid electric vehicle (PHEV) charger module. The application of this high frequency charger will result in lighter, smaller, cheaper, and a more efficient power electronics system.

Original languageEnglish
Title of host publicationProceedings of the 26th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages414-417
Number of pages4
ISBN (Print)9781479929177
DOIs
StatePublished - 2014
Event26th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2014 - Waikoloa, HI, United States
Duration: Jun 15 2014Jun 19 2014

Publication series

NameProceedings of the International Symposium on Power Semiconductor Devices and ICs
ISSN (Print)1063-6854

Conference

Conference26th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2014
Country/TerritoryUnited States
CityWaikoloa, HI
Period06/15/1406/19/14

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