Abstract
The microstructure of large grain melt-processed YBa2Cu3O7-δ containing 10 molar % excess Y2BaCuO5 prepared and oxygenated under atmospheric pressure has been investigated by transmission electron microscopy (TEM) and optical microscopy. These materials always contain parallel structural and microscopic platelet-like features in the crystallographic a-b plane of a few microns spacing which have been variously described as grain boundaries or microcracks. We have observed such features, which clearly influence the flow of current in melt-processed YBCO, to consist of copper deficient, impurity phase material which can be either amorphous or crystalline in nature. A variety of defects have been observed by high-resolution electron microscopy (HREM) in the vicinity of these platelet boundaries, including double and triple CuO layer stacking faults, which may constitute effective flux pinning sites.
| Original language | English |
|---|---|
| Pages (from-to) | 2990-2999 |
| Number of pages | 10 |
| Journal | Journal of Materials Research |
| Volume | 11 |
| Issue number | 12 |
| DOIs | |
| State | Published - Dec 1996 |
| Externally published | Yes |
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