Abstract
Recent trends of increasing core-count and memory/bandwidth-wall have led to major overhauls in chip architecture. In face of increasing cache capacity demands, researchers have now explored DRAM, which was conventionally considered synonymous to main memory, for designing large last level caches. Efficient integration of DRAM caches in mainstream computing systems, however, also presents several challenges and several recent techniques have been proposed to address them. In this paper, we present a survey of techniques for architecting DRAM caches. Also, by classifying these techniques across several dimensions, we underscore their similarities and differences. We believe that this paper will be very helpful to researchers for gaining insights into the potential, tradeoffs and challenges of DRAM caches.
Original language | English |
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Article number | 7181712 |
Pages (from-to) | 1852-1863 |
Number of pages | 12 |
Journal | IEEE Transactions on Parallel and Distributed Systems |
Volume | 27 |
Issue number | 6 |
DOIs | |
State | Published - Jun 1 2016 |
Keywords
- 3D
- Review
- architectural techniques
- bandwidth wall
- classification
- die-stacking
- extreme-scale system
- last level cache
- stacked DRAM