A study of the interactive effects of strain, strain rate and temperature in severe plastic deformation of copper

Travis L. Brown; Christopher Saldana; Tejas G. Murthy; James B. Mann; Yang Guo; Larry F. Allard; Alexander H. King; W. Dale Compton; Kevin P. Trumble; Srinivasan Chandrasekar

doi:10.1016/j.actamat.2009.07.052

A study of the interactive effects of strain, strain rate and temperature in severe plastic deformation of copper

Travis L. Brown, Christopher Saldana, Tejas G. Murthy, James B. Mann, Yang Guo, Larry F. Allard, Alexander H. King, W. Dale Compton, Kevin P. Trumble, Srinivasan Chandrasekar

Nuclear Energy Materials Microanalysis

Research output: Contribution to journal › Article › peer-review

162 Scopus citations

Abstract

The deformation field in machining was controlled to access a range of deformation parameters-strains of 1-15, strain rates of 10-100,000 s^-1 and temperatures of up to 0.4 T_m-in the severe plastic deformation (SPD) of copper. This range is far wider than has been accessed to date in conventional SPD methods, enabling a study of the interactive effects of the parameters on microstructure and strength properties. Nano-twinning was demonstrated at strain rates as small as 1000 s^-1 at -196 °C and at strain rates of ≥10,000 s^-1 even when the deformation temperature was well above room temperature. Bi-modal grain structures were produced in a single stage of deformation through in situ partial dynamic recrystallization. The SPD conditions for engineering specific microstructures by deformation rate control are presented in the form of maps, both in deformation parameter space and in terms of the Zener-Hollomon parameter.

Original language	English
Pages (from-to)	5491-5500
Number of pages	10
Journal	Acta Materialia
Volume	57
Issue number	18
DOIs	https://doi.org/10.1016/j.actamat.2009.07.052
State	Published - Oct 2009

Funding

This work was supported in part by NSF Grants CMMI-0626047 and CMMI-MPM-0800481, the Department of Energy, a Ford University Research Program award and an NSF Graduate Research Fellowship (to CS). Microscopy work at the Oak Ridge National Laboratory’s High Temperature Materials Laboratory was sponsored by the US Department of Energy, Office of Energy Efficiency and Renewable Energy, Vehicle Technologies Program.

Funders	Funder number
Ford University
National Science Foundation	CMMI-0626047, CMMI-MPM-0800481
U.S. Department of Energy
Office of Energy Efficiency and Renewable Energy

Keywords

Copper
Dynamic recrystallization
High speed deformation
Severe plastic deformation
Ultrafine grained microstructure

Access to Document

10.1016/j.actamat.2009.07.052

Cite this

@article{61dbc414f8a84b66a10e907bdeda37c2,

title = "A study of the interactive effects of strain, strain rate and temperature in severe plastic deformation of copper",

abstract = "The deformation field in machining was controlled to access a range of deformation parameters-strains of 1-15, strain rates of 10-100,000 s-1 and temperatures of up to 0.4 Tm-in the severe plastic deformation (SPD) of copper. This range is far wider than has been accessed to date in conventional SPD methods, enabling a study of the interactive effects of the parameters on microstructure and strength properties. Nano-twinning was demonstrated at strain rates as small as 1000 s-1 at -196 °C and at strain rates of ≥10,000 s-1 even when the deformation temperature was well above room temperature. Bi-modal grain structures were produced in a single stage of deformation through in situ partial dynamic recrystallization. The SPD conditions for engineering specific microstructures by deformation rate control are presented in the form of maps, both in deformation parameter space and in terms of the Zener-Hollomon parameter.",

keywords = "Copper, Dynamic recrystallization, High speed deformation, Severe plastic deformation, Ultrafine grained microstructure",

author = "Brown, {Travis L.} and Christopher Saldana and Murthy, {Tejas G.} and Mann, {James B.} and Yang Guo and Allard, {Larry F.} and King, {Alexander H.} and Compton, {W. Dale} and Trumble, {Kevin P.} and Srinivasan Chandrasekar",

year = "2009",

month = oct,

doi = "10.1016/j.actamat.2009.07.052",

language = "English",

volume = "57",

pages = "5491--5500",

journal = "Acta Materialia",

issn = "1359-6454",

publisher = "Elsevier",

number = "18",

}

TY - JOUR

T1 - A study of the interactive effects of strain, strain rate and temperature in severe plastic deformation of copper

AU - Brown, Travis L.

AU - Saldana, Christopher

AU - Murthy, Tejas G.

AU - Mann, James B.

AU - Guo, Yang

AU - Allard, Larry F.

AU - King, Alexander H.

AU - Compton, W. Dale

AU - Trumble, Kevin P.

AU - Chandrasekar, Srinivasan

PY - 2009/10

Y1 - 2009/10

N2 - The deformation field in machining was controlled to access a range of deformation parameters-strains of 1-15, strain rates of 10-100,000 s-1 and temperatures of up to 0.4 Tm-in the severe plastic deformation (SPD) of copper. This range is far wider than has been accessed to date in conventional SPD methods, enabling a study of the interactive effects of the parameters on microstructure and strength properties. Nano-twinning was demonstrated at strain rates as small as 1000 s-1 at -196 °C and at strain rates of ≥10,000 s-1 even when the deformation temperature was well above room temperature. Bi-modal grain structures were produced in a single stage of deformation through in situ partial dynamic recrystallization. The SPD conditions for engineering specific microstructures by deformation rate control are presented in the form of maps, both in deformation parameter space and in terms of the Zener-Hollomon parameter.

AB - The deformation field in machining was controlled to access a range of deformation parameters-strains of 1-15, strain rates of 10-100,000 s-1 and temperatures of up to 0.4 Tm-in the severe plastic deformation (SPD) of copper. This range is far wider than has been accessed to date in conventional SPD methods, enabling a study of the interactive effects of the parameters on microstructure and strength properties. Nano-twinning was demonstrated at strain rates as small as 1000 s-1 at -196 °C and at strain rates of ≥10,000 s-1 even when the deformation temperature was well above room temperature. Bi-modal grain structures were produced in a single stage of deformation through in situ partial dynamic recrystallization. The SPD conditions for engineering specific microstructures by deformation rate control are presented in the form of maps, both in deformation parameter space and in terms of the Zener-Hollomon parameter.

KW - Copper

KW - Dynamic recrystallization

KW - High speed deformation

KW - Severe plastic deformation

KW - Ultrafine grained microstructure

UR - http://www.scopus.com/inward/record.url?scp=70349326124&partnerID=8YFLogxK

U2 - 10.1016/j.actamat.2009.07.052

DO - 10.1016/j.actamat.2009.07.052

M3 - Article

AN - SCOPUS:70349326124

SN - 1359-6454

VL - 57

SP - 5491

EP - 5500

JO - Acta Materialia

JF - Acta Materialia

IS - 18

ER -

A study of the interactive effects of strain, strain rate and temperature in severe plastic deformation of copper

Abstract

Funding

Keywords

Access to Document

Other files and links

Fingerprint

Cite this