A relative comparison of PWB warpage due to simulated infrared and wave soldering processes

W. Sutherlin, Y. Polsky, I. C. Ume

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Current trends in the electronic packaging industry are directed at the miniaturization of electronic component size and increasing component density on printed wiring board assemblies (PWBAs). The trend is also towards the manufacture of thin printed wiring boards (PWBs). Developing such technologies creates heightened issues with printed wiring board warpage, which lead to component misregistration during automated component placement and insertion processes. In addition, daily usage may induce PWBA warpage that could lead to further reliability issues such as premature solder joint failures caused by high residual stresses. It is desirable to understand and avoid such problems as redesigns or repairs to reduce excessive warpage is time consuming and costly. Two types of bare, four layer PWB test vehicles were designed and fabricated to replicate simplified versions of typical boards produced by PWB manufacturers. The boards were subjected to simulated infrared and wave soldering reflow processes in a small lab-scale oven integrated with a shadow moire out-of-plane displacement measurement system. The system is capable of on-line measurement of PWB warpage during operational thermal cycling. The highly automated, computer controlled, lab-scale ovens are able to reproduce virtually any given manufacturer's temperature profile. The results presented show the effects that simulated wave and infrared reflow soldering processes have on the warpage of two different PWB designs.

Original languageEnglish
Title of host publication1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages807-815
Number of pages9
ISBN (Print)0780345266
DOIs
StatePublished - 1998
Externally publishedYes
Event48th Electronic Components and Technology Conference, ECTC 1998 - Seattle, United States
Duration: May 25 1998May 28 1998

Publication series

NameProceedings - Electronic Components and Technology Conference
VolumePart F133492
ISSN (Print)0569-5503

Conference

Conference48th Electronic Components and Technology Conference, ECTC 1998
Country/TerritoryUnited States
CitySeattle
Period05/25/9805/28/98

Fingerprint

Dive into the research topics of 'A relative comparison of PWB warpage due to simulated infrared and wave soldering processes'. Together they form a unique fingerprint.

Cite this