A Plug and Play Power Electronics Education Board for Hands-on Learning of Power Converters Incorporating WBG Semiconductor

Namwon Kim, Chondon Roy, Robert Cox, Babak Parkhideh

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Scopus citations

Abstract

This paper presents the development of a plug-and-play (PP) power electronics education board designed to build a hands-on power electronics lab incorporating wide-bandgap (WBG) semiconductor switches and circuits. The developed education board adopts modular architecture and PP concept to allow students to construct various power electronics experiment setups and handle different semiconductor devices such as Si-based and WBG devices. By inserting the modular daughter boards and completing system connections on the motherboard, various lab experiments can be conducted; from switching characteristic analysis of different semiconductor devices to control of different power converters such as basic DC-DC and DC-AC converters and isolation-type DC-DC converters. This helps students to get familiar with the system/subsystem-level design of power converters and experience the impact of WBG devices compared to Si-based one. The system design considerations are discussed, and the fabricated hardware and its experiments are presented.

Original languageEnglish
Title of host publicationICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2807-2813
Number of pages7
ISBN (Electronic)9788957083130
StatePublished - May 2019
Externally publishedYes
Event10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia - Busan, Korea, Republic of
Duration: May 27 2019May 30 2019

Publication series

NameICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia

Conference

Conference10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia
Country/TerritoryKorea, Republic of
CityBusan
Period05/27/1905/30/19

Funding

ACKNOWLEDGMENT This research was in part of the funding supported by PowerAmerica and the National Science Foundation under Award No. 1610250. The authors would like to thank the Energy Production and Infrastructure Center (EPIC) and Electrical and Computer Engineering Department at the University of North Carolina at Charlotte. This research was in part of the funding supported by PowerAmerica and the National Science Foundation under Award No. 1610250. The authors would like to thank the Energy Production and Infrastructure Center (EPIC) and Electrical and Computer Engineering Department at the University of North Carolina at Charlotte.

Keywords

  • Hands-on education
  • Plug-and-play modular architecture
  • Power electronics lab
  • Wide-bandgap semiconductor devices

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