A Pd-Cu-Ni ternary alloyed membrane on porous nickel support prepared by sputtering and copper reflow

Dong Won Kim, K. Y. Um, Heung Gu Kim, In Seon Lee, Sang Ho Kim, Jong Soo Park, Shin Kun Ryi, Sung Ho Cho

Research output: Contribution to journalArticlepeer-review

7 Scopus citations

Abstract

We propose a ternary, Pd-Cu-Ni, alloyed membrane on porous nickel support that dramatically enhances the hydrogen selectivity by using sputtering and copper reflow. Porous nickel support made by sintering shows strong resistance to hydrogen embrittlement and thermal fatigue. To improve the hydrogen selectivity of the membrane, fabricated the layer sequence of Cu/Pd/Ni on porous nickel support replaced that of conventional Pd/Cu/Ni and then reflow was performed at 700°C. Consequently, copper was reflowed unilaterally into Pd/Ni layer, thereby avoiding delamination by the interlayered copper and enabling infinite hydrogen selectivity because of extremely dense coatings.

Original languageEnglish
Pages (from-to)L233-L234
JournalJapanese Journal of Applied Physics, Part 2: Letters
Volume44
Issue number1-7
DOIs
StatePublished - 2005
Externally publishedYes

Keywords

  • Copper reflow
  • Hydrogen selectivity
  • Pd alloyed coatings
  • Pd-Cu-Ni ternary alloyed membrane
  • Plasma surface modification
  • Porous nickel support

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