Abstract
The performance of vapor chamber is significantly affected by the wick structure, height of the vapor cavity, pillar structure, working fluid, filling ratio, and heat source area. Besides, it can also be influenced by the pillar distribution, which has not been extensively studied in prior literature. Therefore, the present study investigates the influence of pillar distribution on the vapor chamber performance. Totally 11 different vapor chamber models are fabricated and tested, and water is selected as a working fluid for all the samples. The examined geometric features include different mesh layers, mesh sizes, wick structure in condenser surface, pillar distributions, and vapor core space. The results showed that the evaporator with a single-layered mesh provided the thermal resistance of 0.19 K W−1, while triple-layered mesh yielded a thermal resistance of 0.24 K W−1. Moreover, the 2 × 200 mesh offered a maximum heating load of 161 W with a thermal resistance of 0.18 K W−1 against the maximum heating load of 120 W and 75.6 W by the 2 × 150 and 2 × 100 mesh, respectively. The experimental results showed that increasing the pillar numbers alone may not always reduce the thermal resistance, a better pillar distribution can help to direct the vapor flow and improve the performance of the vapor chamber. The proposed vapor chamber with a novel X-wing patterned pillar distribution can offer a thermal resistance of 0.19 K W−1 at a heating load of 146.6 W.
Original language | English |
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Article number | 118217 |
Journal | Applied Thermal Engineering |
Volume | 207 |
DOIs | |
State | Published - May 5 2022 |
Externally published | Yes |
Funding
The authors greatly appreciate the major support from M/s Cooler Master for this project, and part of the support from the Ministry of Science and Technology, Taiwan under the contract 108-2221-E-009-058-MY3.
Funders | Funder number |
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Ministry of Science and Technology, Taiwan | 108-2221-E-009-058-MY3 |
Keywords
- Copper screen mesh
- Electronic cooling
- Pillar distribution
- Thermal resistance
- Vapor chamber