Abstract
Thermal insulation materials are highly desirable for several applications ranging from building envelopes to thermal energy storage systems. A new type of low-cost insulation material called hollow silica particles (HSPs) was recently reported. The present work presents an HSP-based stand-alone composite that has very low thermal conductivity and is highly stable to moisture.
| Original language | English |
|---|---|
| Pages (from-to) | 15373-15377 |
| Number of pages | 5 |
| Journal | RSC Advances |
| Volume | 12 |
| Issue number | 24 |
| DOIs | |
| State | Published - May 20 2022 |
Funding
This research at Oak Ridge National Laboratory, managed by UT Battelle LLC for the US Department of Energy (DOE) under contract DE-AC05-00OR22725, was sponsored by the Office of Energy Efficiency and Renewable Energy (EERE) Building Technologies Office under grant BT0304020 to J. S. A portion of this research used resources at the Building Technologies Research and Integration Centre and the Center for Nanophase Materials Sciences, both DOE Office of Science User Facilities operated by Oak Ridge National Laboratory.