A 10-kW SiC inverter with a novel printed metal power module with integrated cooling using additive manufacturing

Madhu Chinthavali; Curt Ayers; Steven Campbell; Randy Wiles; Burak Ozpineci

doi:10.1109/WiPDA.2014.6964622

A 10-kW SiC inverter with a novel printed metal power module with integrated cooling using additive manufacturing

Madhu Chinthavali, Curt Ayers, Steven Campbell, Randy Wiles, Burak Ozpineci

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

36 Scopus citations

Abstract

With efforts to reduce the cost, size, and thermal management systems for the power electronics drivetrain in hybrid electric vehicles (HEVs) and plug-in hybrid electric vehicles (PHEVs), wide band gap semiconductors including silicon carbide (SiC) have been identified as possibly being a partial solution. This paper focuses on the development of a 10-kW all SiC inverter using a high power density, integrated printed metal power module with integrated cooling using additive manufacturing techniques. This is the first ever heat sink printed for a power electronics application. About 50% of the inverter was built using additive manufacturing techniques.

Original language	English
Title of host publication	2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	48-54
Number of pages	7
ISBN (Electronic)	9781479954933
DOIs	https://doi.org/10.1109/WiPDA.2014.6964622
State	Published - Nov 20 2014
Event	2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014 - Knoxville, United States Duration: Oct 13 2014 → Oct 15 2014

Publication series

Name	2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014

Conference

Conference	2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014
Country/Territory	United States
City	Knoxville
Period	10/13/14 → 10/15/14

Funding

Funders	Funder number
U.S. Department of Energy	DEAC05-00OR22725

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1109/WiPDA.2014.6964622

Cite this

Chinthavali, M., Ayers, C., Campbell, S., Wiles, R., & Ozpineci, B. (2014). A 10-kW SiC inverter with a novel printed metal power module with integrated cooling using additive manufacturing. In 2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014 (pp. 48-54). Article 6964622 (2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/WiPDA.2014.6964622

Chinthavali, Madhu ; Ayers, Curt ; Campbell, Steven et al. / A 10-kW SiC inverter with a novel printed metal power module with integrated cooling using additive manufacturing. 2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 48-54 (2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014).

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title = "A 10-kW SiC inverter with a novel printed metal power module with integrated cooling using additive manufacturing",

abstract = "With efforts to reduce the cost, size, and thermal management systems for the power electronics drivetrain in hybrid electric vehicles (HEVs) and plug-in hybrid electric vehicles (PHEVs), wide band gap semiconductors including silicon carbide (SiC) have been identified as possibly being a partial solution. This paper focuses on the development of a 10-kW all SiC inverter using a high power density, integrated printed metal power module with integrated cooling using additive manufacturing techniques. This is the first ever heat sink printed for a power electronics application. About 50% of the inverter was built using additive manufacturing techniques.",

author = "Madhu Chinthavali and Curt Ayers and Steven Campbell and Randy Wiles and Burak Ozpineci",

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doi = "10.1109/WiPDA.2014.6964622",

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Chinthavali, M, Ayers, C, Campbell, S, Wiles, R & Ozpineci, B 2014, A 10-kW SiC inverter with a novel printed metal power module with integrated cooling using additive manufacturing. in 2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014., 6964622, 2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014, Institute of Electrical and Electronics Engineers Inc., pp. 48-54, 2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014, Knoxville, United States, 10/13/14. https://doi.org/10.1109/WiPDA.2014.6964622

A 10-kW SiC inverter with a novel printed metal power module with integrated cooling using additive manufacturing. / Chinthavali, Madhu; Ayers, Curt; Campbell, Steven et al.
2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 48-54 6964622 (2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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Chinthavali M, Ayers C, Campbell S, Wiles R, Ozpineci B. A 10-kW SiC inverter with a novel printed metal power module with integrated cooling using additive manufacturing. In 2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 48-54. 6964622. (2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014). doi: 10.1109/WiPDA.2014.6964622

A 10-kW SiC inverter with a novel printed metal power module with integrated cooling using additive manufacturing

Abstract

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Funding

UN SDGs

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