A 10-kW SiC inverter with a novel printed metal power module with integrated cooling using additive manufacturing

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

36 Scopus citations

Abstract

With efforts to reduce the cost, size, and thermal management systems for the power electronics drivetrain in hybrid electric vehicles (HEVs) and plug-in hybrid electric vehicles (PHEVs), wide band gap semiconductors including silicon carbide (SiC) have been identified as possibly being a partial solution. This paper focuses on the development of a 10-kW all SiC inverter using a high power density, integrated printed metal power module with integrated cooling using additive manufacturing techniques. This is the first ever heat sink printed for a power electronics application. About 50% of the inverter was built using additive manufacturing techniques.

Original languageEnglish
Title of host publication2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages48-54
Number of pages7
ISBN (Electronic)9781479954933
DOIs
StatePublished - Nov 20 2014
Event2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014 - Knoxville, United States
Duration: Oct 13 2014Oct 15 2014

Publication series

Name2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014

Conference

Conference2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014
Country/TerritoryUnited States
CityKnoxville
Period10/13/1410/15/14

Funding

FundersFunder number
U.S. Department of EnergyDEAC05-00OR22725

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