@inproceedings{830d2319e80e426f8a71fc4931bc1b2e,
title = "3D IC pixel electronics-the next challenge",
abstract = "There is no question that 3D integrated circuit design will play an important role in the continuing development of high performance integrated circuits. This paper will provide a brief introduction to the markets for 3D integrated circuits and the technologies that are used, followed by a review of 3D activities in High Energy Physics (HEP). The paper will review the first 3D chip for HEP and conclude with discussion of a collaborative effort to use a commercial vendor to fabricate 3D ICs as a path forward to meet the next challenge for electronics designers in HEP.",
author = "R. Yarema and D. Christian and M. Demarteau and G. Deptuch and J. Hoff and R. Lipton and A. Shenai and M. Trimpl and T. Zimmerman",
year = "2008",
language = "English",
isbn = "9789290833246",
series = "Proceedings of the Topical Workshop on Electronics for Particle Physics, TWEPP 2008",
pages = "183--187",
booktitle = "Proceedings of the Topical Workshop on Electronics for Particle Physics, TWEPP 2008",
note = "Topical Workshop on Electronics for Particle Physics, TWEPP 2008 ; Conference date: 15-09-2008 Through 19-09-2008",
}