TY - JOUR
T1 - 3D design activities at Fermilab - Opportunities for physics
AU - Yarema, Raymond
AU - Deptuch, Grezgorz
AU - Hoff, Jim
AU - Shenai, Alpana
AU - Trimpl, Marcel
AU - Zimmerman, Tom
AU - Demarteau, Marcel
AU - Lipton, Ron
AU - Christian, Dave
PY - 2010/5/11
Y1 - 2010/5/11
N2 - Fermilab began exploring the technologies for vertically integrated circuits (also commonly known as 3D circuits) in 2006. These technologies include through silicon vias (TSV), circuit thinning, and bonding techniques to replace conventional bump bonds. Since then, the interest within the High Energy Physics community has grown considerably. This paper will present an overview of the activities at Fermilab over the last 3 years which have helped spark this interest.
AB - Fermilab began exploring the technologies for vertically integrated circuits (also commonly known as 3D circuits) in 2006. These technologies include through silicon vias (TSV), circuit thinning, and bonding techniques to replace conventional bump bonds. Since then, the interest within the High Energy Physics community has grown considerably. This paper will present an overview of the activities at Fermilab over the last 3 years which have helped spark this interest.
KW - 3D integration
KW - Vertical integration
UR - http://www.scopus.com/inward/record.url?scp=79953792248&partnerID=8YFLogxK
U2 - 10.1016/j.nima.2009.09.045
DO - 10.1016/j.nima.2009.09.045
M3 - Article
AN - SCOPUS:79953792248
SN - 0168-9002
VL - 617
SP - 375
EP - 377
JO - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
JF - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
IS - 1-3
ER -