An Ultralow Thermal Conductivity Material

The objective of this project is to develop economical hollow silica particle-based insulation material with thermal resistance (R≈14) 2.0-2.5 times higher than that of conventional insulation materials (polyurethane or polyisocyanurate foam boards; R-6). To achieve the targeted thermal resistance of the new insulation material, the project team will seek to (1) maximize air volume in order to lower the solid conduction, (2) maximize interface phonon mismatch and phonon scattering to reduce interfacial heat transfer among various components, and (3) minimize the radiative heat transfer. The first phase focuses on achieving the high R-value for the material, while the second phase focus on testing and improving the mechanical strength, moisture stability, fire-resistance of the material.

Project Impact

Hollow particle-based insulation material will have R-values approximately 2.25 times higher than that of conventional insulation materials such as polyurethane or polyisocyanurate foam boards. Therefore, a much thinner layer of the material will achieve the same level of insulating value as that of a much thicker layer of the available insulation materials, which enables easier retrofitting of buildings where space is limited. Superior robustness of the hollow particle-based material compared to the state-of-the-art insulation materials, such as aerogels and vacuum insulation panels, will also improve the ease of handling and installation, while lower costs will make it a more affordable option for American households.