Overview
Education/Academic qualification
Eng-Mechanical, Master's Degree
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Dive into the research topics where Whit Vinson is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Failure Mode Progression Driven by Thermal-Electric Stressors in Aluminum Wire Bonds
Vinson, W. & Huitink, D., 2026, In: IEEE Transactions on Device and Materials Reliability. 26, 1, p. 83-92 10 p.Research output: Contribution to journal › Article › peer-review
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Modified tumor uptake and biodistribution of nanoparticles coated with small extracellular vesicle membranes derived from distinct tumor cell lines
Jenkins, S. V., Carlton, H., Scott, B., Stahr, S. D., Vinson, W., Fletcher, G., Jamshidi-Parsian, A., Hsu, P. C., Dings, R. P. M., Huitink, D. & Griffin, R. J., 2026, In: International Journal of Hyperthermia. 43, 1, 2624448.Research output: Contribution to journal › Article › peer-review
Open Access -
Electromigration in Eutectic Gold-Tin (80Au20Sn-wt%) Solder Joints
Vinson, W. & Huitink, D., Nov 2025, In: Journal of Electronic Materials. 54, 11, p. 10439-10448 10 p.Research output: Contribution to journal › Article › peer-review
Open Access -
Examining Wire Bond Coatings for Application in High Power Density Systems
Vinson, W., Carballo, K. V., Torres, F., Meng, X. & Huitink, D., Dec 1 2025, In: Journal of Electronic Packaging, Transactions of the ASME. 147, 4, 041101.Research output: Contribution to journal › Article › peer-review
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Altering Electromigration Response in Aluminum Wire Bonds through Heat Treatment
Vinson, W., Torres, F. & Huitink, D., 2024, Proceedings of the 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2024. IEEE Computer Society, (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
2 Scopus citations