Overview
Education/Academic qualification
Eng-Civil Engineering, Doctorate Degree
Fingerprint
Dive into the research topics where Komal Chawla is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
-
Engineering mechanical and thermomechanical performance in additive manufacturing–Compression molded composites through multiplexed extrusion
Wasti, S., Talabi, S. I., Hubbard, A. M., Chawla, K., Owusu, A., Mungale, C., Vaidya, U., Hassen, A. A., Ozcan, S., Tekinalp, H. & Kumar, V., Aug 15 2026, In: Composites Part B: Engineering. 323, 113799.Research output: Contribution to journal › Article › peer-review
-
Modeling and Simulation of LFAM: Polymers, Metals, and Cements and Clays, a Review
Lee, Y., Chawla, K., Alnaggar, M., Dong, W. & Kim, S., Jan 1 2026, Large Format Additive Manufacturing: Polymers, Metals, and Ceramics. wiley, p. 439-473 35 p.Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review
-
Performance assessment of 3D printed multi-material energy absorber for automotive bumper: pedestrian lower extremity protection
Chawla, K., Hassen, A. A., Garg, N., Pokkalla, D. K., Smith, T., Rodriguez, B., Yao, D., Zheng, R., Lee, E., Farooq, I., Rebandt, M., Khan, A. & Kim, S., Apr 1 2026, In: Composite Structures. 381, 120056.Research output: Contribution to journal › Article › peer-review
-
Benchmarking image processing techniques for porosity measurement in polymer additive manufacturing: Review and experimental analysis
Chawla, K., Talabi, S. I., Rodriguez, B., Kumar, V., Kim, S., Kunc, V. & Hassen, A. A., Nov 15 2025, In: Composites Part B: Engineering. 307, 112857.Research output: Contribution to journal › Review article › peer-review
6 Scopus citations -
Benchmarking of AM-CM system capabilities to make parts with amorphous and semicrystalline composites
Talabi, S. I., Chawla, K., Rodriguez, B., Barakat, A., Phadatare, A., Hassen, A. A., Vaidya, U., Kunc, V. & Kumar, V., 2025.Research output: Contribution to conference › Paper › peer-review