Projects per year
Overview
Education/Academic qualification
Sci-Ceramics, Doctorate Degree
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Dive into the research topics where Hsin Wang is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Projects
- 1 Finished
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Temperature-Regulated Batteries
Wang, H. (PI)
Advanced Research Projects Agency - Energy
10/1/12 → 02/15/15
Project: Research
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Additively Manufactured Carbon Fiber-Reinforced Siliconized Silicon Carbide Composites Using Carbon Fiber-Reinforced Poly-Ether-Ether-Ketone (PEEK) as a Precursor
Yoon, B., Klett, J. W., Paul, R. M., Lance, M. J., Wang, H., Nawaz, K. & Lara-Curzio, E., Jun 2026, In: Ceramics. 9, 6, 60.Research output: Contribution to journal › Article › peer-review
Open Access -
An International Round-Robin Study on Thermoelectric Module Testing and Development of Standard Power Generation Modules
Wang, H., Bai, S., Bouteiller, H., Cuenat, A., Díaz-Chao, P., Goth, N., Liao, J., Konig, J., Maddux, J., Oh, M. W., Parker, T., Salvador, J. R., Song, Q., Taylor, P., Vasilevskiy, D. & Verdier, P., Apr 2026, In: Journal of Electronic Materials. 55, 4, p. 3402-3417 16 p.Research output: Contribution to journal › Article › peer-review
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Author Correction: Overcoming the thermal conductivity versus oxidation resistance barrier in high-temperature steels (Communications Materials, (2025), 6, 1, (262), 10.1038/s43246-025-00981-2)
Pierce, D., Pillai, R., Wang, H., Poplawsky, J., Haynes, J., Sebeck, K., Tess, M., Gingrich, E. & Muralidharan, G., Dec 2026, In: Communications Materials. 7, 1, 12.Research output: Contribution to journal › Comment/debate
Open Access -
Correction: An International Round-Robin Study on Thermoelectric Module Testing and Development of Standard Power Generation Modules (Journal of Electronic Materials, (2026), 10.1007/s11664-025-12624-w)
Wang, H., Bai, S., Bouteiller, H., Cuenat, A., Díaz-Chao, P., Goth, N., Liao, J., Konig, J., Maddux, J., Oh, M. W., Parker, T., Salvador, J. R., Song, Q., Taylor, P., Vasilevskiy, D. & Verdier, P., Apr 2026, In: Journal of Electronic Materials. 55, 4, p. 3418 1 p.Research output: Contribution to journal › Comment/debate
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Development of copper thiolate organometallic compound as thermal sensitive coating for energy storage system safety
Kumara, C., Meyer, H. M., Polo-Garzon, F., Armstrong, B. & Wang, H., Jan 1 2026, In: Journal of Energy Storage. 141, 119170.Research output: Contribution to journal › Article › peer-review