Huang, P. J.,
Lin, H. Y., Rukruang, A. & Wang, C. C.,
2024,
Proceedings of the 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2024. IEEE Computer Society, (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review