Publications per year
Publications per year
Overview
Education/Academic qualification
Eng-Computer, Master's Degree
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Dive into the research topics where Clay Leach is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
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Automated Plant Tissue Excision and Manipulation via Integrated Robotics and Machine Vision for Plant Transformation
Walters, H. A., Leach, C., Paquit, V., Nycz, A. & Kalluri, U. C., 2025, 2025 IEEE 21st International Conference on Automation Science and Engineering, CASE 2025. IEEE Computer Society, p. 1310-1315 6 p. (IEEE International Conference on Automation Science and Engineering).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Demonstrating Advanced Sensors for In-Situ Monitoring Towards Qualification of Nuclear Relevant Components
Hyer, H., Scime, L., Snow, Z., Kendall, J., Schreiber, B., Petrie, C., Leach, C., Joslin, C. & McDonald, T., 2025, United StatesResearch output: Other contribution › Technical Report
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In-situ digital image correlation and thermal monitoring in directed energy deposition
Haley, J. (Inventor), Dehoff, R. (Inventor), Paquit, V. C. (Inventor) & Leach, S. C. (Inventor), 2024Research output: Patent
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Review of In Situ Sensing for Directed Energy Deposition for Industrial Part Quality Assessment
Snow, Z., Haley, J., Leach, C., Halsey, W. & Paquit, V., Jun 2024, United StatesResearch output: Other contribution › Technical Report
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Method and system for automated plant surveillance and manipulation
Kalluri, U. C. (Inventor), Nycz, A. (Inventor), Love, L. J. (Inventor), Paquit, V. C. (Inventor), Yang, X. (Inventor), Leach, S. C. (Inventor) & Walters, H. (Inventor), 2023Research output: Patent
Awards
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2023 R&D 100 Award for OpeN-AM: A Platform for Operando Neutron Diffraction Measurements of Additive Manufacturing
Plotkowski, A. (Recipient), Fancher, C. (Recipient), Saleeby, K. (Recipient), Haley, J. (Recipient), An, K. (Recipient), Yu, D. (Recipient), Feldhausen, T. (Recipient), Madireddy, G. (Recipient), Lee, Y. (Recipient), Vaughan, J. (Recipient), Babu, S. (Recipient), Heineman, J. (Recipient), Leach, C. (Recipient), Tang, W. (Recipient) & Shyam, A. (Recipient), 2023
Prize: Honorary award