Overview
Education/Academic qualification
Eng-Matls Sci, Doctorate Degree
Fingerprint
- 1 Similar Profiles
-
Additively-manufactured Al-0.3Zr-0.2Ce-0.2Cu alloy with high creep resistance and electrical conductivity
Rakhmonov, J., Poplawsky, J., Allard, L., Burns, J., Qi, J., Coello, I., Dunand, D. C., Bahl, S., Perrin, A., Haynes, J. A., Plotkowski, A. & Shyam, A., Jan 1 2026, In: Acta Materialia. 304, 121785.Research output: Contribution to journal › Article › peer-review
3 Scopus citations -
A first principles approach for determining solute effect on electrical resistivity of Aluminum solid solution
Samolyuk, G., Shyam, A. & Yoon, M., Mar 15 2026, In: Scripta Materialia. 274, 117138.Research output: Contribution to journal › Article › peer-review
-
Assessment of binary eutectic Ni alloys for high-temperature applications via laser remelting
Ekaputra, C. N., Joslin, C., Carver, K., Plotkowski, A. & Shyam, A., May 15 2026, In: Journal of Alloys and Compounds. 1066, 188363.Research output: Contribution to journal › Article › peer-review
-
Novel Non-Atomizing Process for Producing Powder for Additive Manufacturing
Shyam, A., Rakhmonov, J., Plotkowski, A., Dehoff, R. & Aldridge, C., 2026, United StatesResearch output: Other contribution › Technical Report
-
Strain-rate hardening enhances fatigue resistance of AlSi10Mg alloy at 350°C
Bahl, S., Richter, N. A., Torbet, C., Rakhmonov, J. U., Su, Y. F., Plotkowski, A., Pollock, T. M. & Shyam, A., Feb 15 2026, In: Acta Materialia. 305, 121866.Research output: Contribution to journal › Article › peer-review
1 Scopus citations
Awards
-
2022 R&D 100 Award for DuAlumin-3D: An Additively Manufactured Dual-Strengthened Aluminum Alloy Designed for Extreme Creep and Fatigue Resistance
Plotkowski, A. (Recipient), Wang, Q. (Recipient), Jones, J. (Recipient), Wang, A. (Recipient), Hess, D. (Recipient), Wilson, D. (Recipient), Gerard, D. (Recipient), Burkle, D. (Recipient), Jones, R. (Recipient), Stansberry, C. (Recipient), Shyam, A. (Recipient), Dehoff, R. (Recipient), Haynes, J. A. (Recipient), Michi, R. A. (Recipient), Bahl, S. (Recipient), Yang, Y. (Recipient), Allard Jr, L. (Recipient), Poplawsky, J. (Recipient), Peter, B. (Recipient), Splitter, D. (Recipient), Jun, J. (Recipient) & Sisco, K. (Recipient), 2022
Prize: Honorary award
-
2023 R&D 100 Award for OpeN-AM: A Platform for Operando Neutron Diffraction Measurements of Additive Manufacturing
Plotkowski, A. (Recipient), Fancher, C. (Recipient), Saleeby, K. (Recipient), Haley, J. (Recipient), An, K. (Recipient), Yu, D. (Recipient), Feldhausen, T. (Recipient), Madireddy, G. (Recipient), Lee, Y. (Recipient), Vaughan, J. (Recipient), Babu, S. (Recipient), Heineman, J. (Recipient), Leach, C. (Recipient), Tang, W. (Recipient) & Shyam, A. (Recipient), 2023
Prize: Honorary award