Projects per year
Fingerprint
Researcher collaborations from the last five years
Profiles
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Gerry Knapp
- Multiscale Modeling & Materials by Desig - Process Modeling for Advanced Manufactur
Person
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Sunyong Kwon
- Multiscale Modeling & Materials by Desig - Computational Thermodynamics- R&D Associ
Person
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Yuri Osetskiy
- Multiscale Modeling & Materials by Desig - GrpMbr, Microstructure Evolution Modelin
Person
Projects
- 2 Finished
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Advance Castable Nanostructured Alloys for First-Wall/Blanket Applications
Yang, Y. (PI)
Advanced Research Projects Agency - Energy
03/15/21 → 09/14/24
Project: Research
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Research output
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Ab Initio Simulation of Medium-Range Ordering in Ionic Glass Electrolytes LiSiPON and LiNaSiPON
Osetsky, Y. N., Shinohara, Y., Samolyuk, G. D., Egami, T. & Westover, A. S., May 5 2025, In: ACS Materials Letters. 7, 5, p. 1717-1722 6 p.Research output: Contribution to journal › Article › peer-review
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A high-throughput approach for statistical process optimization in Laser Powder Bed Fusion
Ye, J., Coleman, J., Knapp, G. L., Peles, A., Joslin, C., Graham, S., Plotkowski, A. & Elwany, A., Aug 15 2025, In: Journal of Manufacturing Processes. 147, p. 88-99 12 p.Research output: Contribution to journal › Article › peer-review
1 Scopus citations -
Application of polyhedron model to predict heat capacity of mixed oxides
Arias-Hernandez, J. A., Kwon, S. Y. & Moosavi-Khoonsari, E., Jun 2025, In: Calphad: Computer Coupling of Phase Diagrams and Thermochemistry. 89, 102836.Research output: Contribution to journal › Article › peer-review
Open Access
Prizes
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2021 R&D 100 Award for UCC: Ultraconductive Copper-Carbon Nanotube Composite
Aytug, T. (Recipient), Li, K. (Recipient), Ozpineci, B. (Recipient), McGuire, M. (Recipient), List III, F. (Recipient), Ozcan, S. (Recipient), Skolrood, L. (Recipient), Ivanov, I. (Recipient), Yoon, M. (Recipient) & Lupini, A. (Recipient), 2021
Prize: Honorary award
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2022 R&D 100 Award for DuAlumin-3D: An Additively Manufactured Dual-Strengthened Aluminum Alloy Designed for Extreme Creep and Fatigue Resistance
Plotkowski, A. (Recipient), Wang, Q. (Recipient), Jones, J. (Recipient), Wang, A. (Recipient), Hess, D. (Recipient), Wilson, D. (Recipient), Gerard, D. (Recipient), Burkle, D. (Recipient), Jones, R. (Recipient), Stansberry, C. (Recipient), Shyam, A. (Recipient), Dehoff, R. (Recipient), Haynes, J. A. (Recipient), Michi, R. A. (Recipient), Bahl, S. (Recipient), Yang, Y. (Recipient), Allard, L. (Recipient), Poplawsky, J. (Recipient), Peter, B. (Recipient), Splitter, D. (Recipient), Jun, J. (Recipient) & Sisco, K. (Recipient), 2022
Prize: Honorary award
Datasets
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FeSi binary alloy electronic structure low-Si dataset (1024 atoms)
Lupo Pasini, M. (Creator), Reeve, S. T. (Creator), Samolyuk, G. (Creator), Ellis, D. (Creator) & Eisenbach, M. (Creator), Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States). Oak Ridge Leadership Computing Facility (OLCF); Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States), Feb 15 2021
DOI: 10.13139/ORNLNCCS/1765080
Dataset
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Inelastic Neutron Scattering Data for FeSn
Do, S.-H. (Creator), Kaneko, K. (Creator), Kajimoto, R. (Creator), Kamazawa, K. (Creator), Stone, M. (Creator), Lin, J. (Creator), Itoh, S. (Creator), Masuda, T. (Creator), Samolyuk, G. (Creator), Dagotto, E. (Creator), Meier, W. (Creator), Sales, B. (Creator), Miao, H. (Creator) & Christianson, A. (Creator), Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States). Oak Ridge Leadership Computing Facility (OLCF); Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States), Jun 3 2022
DOI: 10.13139/ORNLNCCS/1870675
Dataset
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TaV_BCC_SolidSolution_128atoms_VASP6
Lupo Pasini, M. (Creator), Samolyuk, G. (Creator), Eisenbach, M. (Creator), Choi, J. Y. (Creator), Yin, J. (Creator) & Yang, Y. (Creator), Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States). Oak Ridge Leadership Computing Facility (OLCF); Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States), Dec 29 2023
Dataset