Fingerprint
Researcher collaborations from the last five years
Profiles
-
Electroslag additive manufacturing: A pathway for high throughput near net shape production
Stevens, A. G., Singh, V., Kannan, R., Hebble, D., Graham, S., Mhatre, P., Zinn, K., Masuo, C., Carter, W., Heineman, J., Rossy, A. M., Shanafield, A. B., Savage, C., Roschli, A., Hicks, B., Nandwana, P., Babu, S. S. & Post, B. K., Apr 2026, In: Additive Manufacturing Letters. 17, 100343.Research output: Contribution to journal › Article › peer-review
Open Access -
Future foundries: A convergent manufacturing platform
Ghosh, S., Hoffmann, M., Heinrich, L., Fillingim, K. B., Vaughan, J., Post, B. K. & Feldhausen, T., Apr 2026, In: Additive Manufacturing Letters. 17, 100364.Research output: Contribution to journal › Article › peer-review
Open Access -
Genesis of a novel high-rate composite manufacturing process using large-scale additive manufacturing – compression molding (AM-CM) system: Possibilities and limitations∗
Kumar, V., Hassen, A. A., Kunc, V., Nuttall, D., Kircaliali, A., Talabi, S. I., Reynolds, J., Vaughan, J., Mhatre, P., Smith, T., Šeta, B., Spangenberg, J. & Blue, C., Jan 15 2026, In: Composites Part B: Engineering. 309, 113101.Research output: Contribution to journal › Article › peer-review
Prizes
-
2018 R&D 100 Award for Ambient Reactive Extrusion Additive Manufacturing
Rios, O. (Recipient), Carter, W. (Recipient), Love, L. (Recipient), Lloyd, P. (Recipient) & Post, B. (Recipient), 2018
Prize: Honorary award
-
2019 R&D 100 Award for High Strength Binder System for Additive Manufacturing
Saito, T. (Recipient), Elliott, A. (Recipient), Han, L. (Recipient), Gilmer, D. (Recipient) & Lehmann, M. (Recipient), 2019
Prize: Honorary award
-
2023 R&D 100 Award for OpeN-AM: A Platform for Operando Neutron Diffraction Measurements of Additive Manufacturing
Plotkowski, A. (Recipient), Fancher, C. (Recipient), Saleeby, K. (Recipient), Haley, J. (Recipient), An, K. (Recipient), Yu, D. (Recipient), Feldhausen, T. (Recipient), Madireddy, G. (Recipient), Lee, Y. (Recipient), Vaughan, J. (Recipient), Babu, S. (Recipient), Heineman, J. (Recipient), Leach, C. (Recipient), Tang, W. (Recipient) & Shyam, A. (Recipient), 2023
Prize: Honorary award