Bridges, R. A., Weber, B., Beaver, J. M., Smith, J. M., Verma, M. E., Norem, S., Spakes, K., Watson, C., Nichols, J. A.,
Jewell, B., Iannacone, M. D.,
Stahl, C. D.,
Huffer, K. M. T. & Oesch, T. S.,
2023,
Proceedings - 2023 IEEE International Conference on Big Data, BigData 2023. He, J., Palpanas, T., Hu, X., Cuzzocrea, A., Dou, D., Slezak, D., Wang, W., Gruca, A., Lin, J.C.-W. & Agrawal, R. (eds.).
Institute of Electrical and Electronics Engineers Inc.,
p. 1620-1629 10 p. (Proceedings - 2023 IEEE International Conference on Big Data, BigData 2023).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review